Intel® NUC Board Element CMB1BB
Specifications
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Essentials
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Product Collection
Intel® NUC Board Elements
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Code Name
Products formerly Butler Beach
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Marketing Status
Launched
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Launch Date
Q4'19
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Supported Operating Systems
Windows 11*, Windows 10*, Linux*
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Board Form Factor
U-series Element Carrier Board
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Internal Drive Form Factor
M.2 SSD
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# of Internal Drives Supported
1
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TDP
15 W
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DC Input Voltage Supported
12V~24V
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Warranty Period
3 yrs
Supplemental Information
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Datasheet
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Description
The modular Intel® NUC Board Element designed to take a range of Intel® NUC Compute Elements. Also available as modular carrier board with built in thermal solution. Ideal for providers creating embedded solutions.
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Product Brief
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Additional Information
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Memory & Storage
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Memory Types
Requires NUC Compute Element (U)
Processor Graphics
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Graphics Output
Dual HDMI 2.0, eDP
Expansion Options
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M.2 Card Slot (storage)
2280 M-key (NVMe/SATA)
I/O Specifications
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# of USB Ports
4
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USB Configuration
4x rear USB 3.2 Gen2 (10Gbps)
2x USB 2.0 via internal headers
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Integrated LAN
Intel® i219-LM GbE
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Additional Headers
Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V); Internal 2x2 power connector
Ordering and Compliance
Drivers and Software
Description
Type
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Version
Date
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Latest Drivers & Software
Name
Intel® Gigabit Ethernet Driver for Windows® 10 64-bit & Windows 11* for Intel® NUC Chassis Elements and Board Elements
Support
Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Warranty Period
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Additional Headers
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.