Intel® NUC Rugged Board Element CMB1ABA


Supplemental Information

  • Marketing Status End of Support
  • Launch Date Q4'19
  • Warranty Period 3 yrs
  • Datasheet View now
  • Description The modular Intel® NUC Rugged Board designed for the Intel® NUC Rugged Chassis Element or for use in a third-party chassis and/or embedded solutions. The expandable board – with two headers and serial DV9 - is designed for edge analytics.
  • Product Brief View now
  • Additional Information View now

Memory & Storage

  • Internal Drive Form Factor M.2 SSD
  • # of Internal Drives Supported 2
  • M.2 Card Slot (storage) 2280, 2242/80 (M-key)

I/O Specifications

  • Graphics Output Dual HDMI, eDP
  • # of Displays Supported 3
  • USB Configuration USB 3.2g2: 1x front, 2x rear ports
    USB 3.1g1: 1x header
    USB 2.0: 1x front port, 2x headers

  • # of Serial Ports 2
  • Serial Port via Internal Header Yes
  • Integrated LAN Intel® i219-LM GbE
  • Additional Headers Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector

Package Specifications

  • TDP 15 W
  • DC Input Voltage Supported 12V~24V
  • Chassis Dimensions 170 x 136.4 mm
  • Board Form Factor U-series Element Carrier Board

Drivers and Software

Latest Drivers & Software

Downloads Available:



Launch Date

The date the product was first introduced.

Warranty Period

Warranty document for this product is available on

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Additional Headers

Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.