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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® NUC Rugged Board Element CMB1ABA

Specifications

Export specifications

Essentials

Supplemental Information

  • Marketing Status End of Support
  • Launch Date Q4'19
  • Warranty Period 3 yrs
  • Datasheet View now
  • Description The modular Intel® NUC Rugged Board designed for the Intel® NUC Rugged Chassis Element or for use in a third-party chassis and/or embedded solutions. The expandable board – with two headers and serial DV9 - is designed for edge analytics.
  • Product Brief View now
  • Additional Information View now

Memory & Storage

  • Internal Drive Form Factor M.2 SSD
  • # of Internal Drives Supported 2
  • M.2 Card Slot (storage) 2280, 2242/80 (M-key)

I/O Specifications

  • Graphics Output Dual HDMI, eDP
  • # of Displays Supported ‡ 3
  • USB Configuration USB 3.2g2: 1x front, 2x rear ports
    USB 3.1g1: 1x header
    USB 2.0: 1x front port, 2x headers
  • # of Serial Ports 2
  • Serial Port via Internal Header Yes
  • Integrated LAN Intel® i219-LM GbE
  • Additional Headers Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector

Package Specifications

  • TDP 15 W
  • DC Input Voltage Supported 12V~24V
  • Chassis Dimensions 170 x 136.4 mm
  • Board Form Factor U-series Element Carrier Board

Drivers and Software

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Launch Date

The date the product was first introduced.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Additional Headers

Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.