Intel® Server System LWK2LC3U4880A
Specifications
Compare Intel® Products
Essentials
-
Product Collection
Intel® Server System S9200WK Family
-
Code Name
Products formerly Walker Pass
-
Launch Date
Q2'19
-
Marketing Status
Discontinued
-
Expected Discontinuance
2022
-
Limited 3-year Warranty
Yes
-
Supported Operating Systems
Red Hat Enterprise Linux 7.6*, CentOS 7.6*
-
Chassis Form Factor
2U Rack front IO
-
Board Form Factor
8.33” x 21.5”
-
TDP
350 W
-
Board Chipset
Intel® C621 Chipset
-
Target Market
High Performance Computing
-
Included Items
(1) Intel® Server Chassis, FC2HLC21W3X
(4) Intel® Server System S9248WK1HLCX Compute Module.
(96) Micron 16GB RDIMM, MTA18ASF2G72PDZ-2G9E1
(8) Intel® SSD D3-S4510, SSDSCKKB240G801
(4) Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x16, 100HFA016LS
(4) Remote Management Module 4 Lite 2 AXXRMM4LITE2
(1) I/O Breakout cable spare kit AXXCONNTDBG
Sign in with your CNDA account to view additional SKU details.
Supplemental Information
-
Description
Intel® S9200WK System featuring Intel® Xeon®
Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000.
2U/4N Liquid Cooled.
Memory & Storage
-
Storage Profile
All-Flash Storage Profile
-
Included Memory
1.5TB DDR4 RAM
-
Memory Types
DDR4 RDIMM 2933
-
Max Memory Size (dependent on memory type)
12 TB
-
Included Storage
1.9 TB
-
# of Internal Drives Supported
8
-
Internal Drive Form Factor
M.2 SSD
Expansion Options
Package Specifications
-
Max CPU Configuration
8
Advanced Technologies
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
No results found for
Y
/apps/intel/arksuite/template/arkProductPageTemplate
Latest Drivers & Software
Name
Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems
Intel® One Boot Flash Update (Intel® OFU) Utility for Intel® Server Boards and Intel® Server Systems Based on Intel® 62X Chipset
Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Linux*
The Intel® Server System S9200WK Product Family BIOS and Firmware Update (FSUP_BIOS/ME/BMC/FRU)
Intel® Server System S9200WK Product Family UEFI System Update Package (SUP)
Intel® Configuration Detector for Linux*
BMC Source Code for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Intel® One Boot Flash Update (Intel® OFU) Utility for the Intel® Server System S9200WK Product Family
Intel® Server System S9200WK Power Budget Tool
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Storage Profile
Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.
Included Memory
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
PCIe x16 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.