Intel® FPGA PAC D5005

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Specifications

Export specifications

Memory Specifications

I/O Specifications

Supplemental Information

Package Specifications

  • Tools Supported Intel® Acceleration Stack for Intel® Xeon® CPU with FPGAs, Intel® Quartus® Prime Software, Open Programmable Acceleration Engine (OPAE), Intel® Distribution of OpenVINO™ toolkit, Data Plane Developer Kit (DPDK)
  • Datasheet View now
  • Description Intel FPGA PAC D5005, previously known as Intel PAC with Intel Stratix® 10 SX FPGA, offers inline high-speed interfaces up to 100 Gbps.

Compatible Products

Intel® Server System R2000WF Family

Product Name Launch Date Status Board Form Factor Chassis Form Factor Socket SortOrder Compare
All | None
Intel® Server System R2208WFTZSR Q2'19 Launched Custom 16.7" x 17" 2U, Spread Core Rack Socket P
Intel® Server System R2208WF0ZSR Q2'19 Launched Custom 16.7" x 17" 2U, Spread Core Rack Socket P
Intel® Server System R2308WFTZSR Q2'19 Launched Custom 16.7" x 17" 2U, Spread Core Rack Socket P
Intel® Server System R2208WFQZSR Q2'19 Launched Custom 16.7" x 17" 2U, Spread Core Rack Socket P

Intel® Server Board S2600WF Family

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP SortOrder Compare
All | None
Intel® Server Board S2600WFQ Discontinued Custom 16.7" x 17" Rack Socket P No 205 W
Intel® Server Board S2600WF0 Discontinued Custom 16.7" x 17" Rack Socket P No 205 W
Intel® Server Board S2600WFT Discontinued Custom 16.7" x 17" Rack Socket P No 205 W

Downloads and Software

Launch Date

The date the product was first introduced.

FPGA

Field programmable gate arrays (FPGAs) are integrated circuits that enable designers to program customized digital logic in the field.

Logic Elements (LE)

Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.

DSP Blocks

Each FPGA mounted on a programmable acceleration card contains digital signal processor (DSP) blocks within the FPGA architecture. DSPs are used to filter and compress real-world analog signals. The dedicated DSP blocks within the FPGA have been optimized to implement various common DSP functions with maximum performance and minimum logic resource utilization.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.

QSFP Interface

Intel PACs are equipped with QSFP (eg QSFP+, QSFP28) cages on the front panel of the board. Please refer to product datasheet for a list of Intel-supported connectors. For volume deployment, customers are required to use Intel-validated QSFP modules.

Thermal Solution Specification

Intel Reference Heat Sink specification for proper operation of this processor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.