Intel® FPGA PAC N3000


Memory Specifications

  • External Onboard DDR4 9 GB
  • External Onboard SRAM 144 Mb QDR IV

I/O Specifications

Supplemental Information

Package Specifications

  • Tools Supported Intel® Acceleration Stack for Intel® Xeon® CPU with FPGAs, Intel® Quartus® Prime Software, Open Programmable Acceleration Engine (OPAE), Data Plane Developer Kit (DPDK)
  • Datasheet View now
  • Description Intel FPGA PAC N3000 accelerates network traffic for up to 100 Gbps to support low-latency, high-bandwidth 5G applications.

Drivers and Software

Latest Drivers & Software

Downloads Available:


Intel® vRAN Baseband Driver and Tools for VMware ESXi*

Driver and Tools for Management of Intel® N3000 FPGA PAC for VMware ESXi*

Launch Date

The date the product was first introduced.


Field programmable gate arrays (FPGAs) are integrated circuits that enable designers to program customized digital logic in the field.

Logic Elements (LE)

Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.

DSP Blocks

Each FPGA mounted on a programmable acceleration card contains digital signal processor (DSP) blocks within the FPGA architecture. DSPs are used to filter and compress real-world analog signals. The dedicated DSP blocks within the FPGA have been optimized to implement various common DSP functions with maximum performance and minimum logic resource utilization.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

QSFP Interface

Intel PACs are equipped with QSFP (eg QSFP+, QSFP28) cages on the front panel of the board. Please refer to product datasheet for a list of Intel-supported connectors. For volume deployment, customers are required to use Intel-validated QSFP modules.

Thermal Solution Specification

Intel Reference Heat Sink specification for proper operation of this processor.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.