Intel® Server System MCB2224BPAF3R
Compare Intel® Products
Intel® Data Center Blocks for Cloud (Intel® DCB for Cloud)
Products formerly Buchanan Pass
Microsoft Windows Server 2019* Software-Defined Data Center (SDDC) Premium
Rack Rails Included
Compatible Product Series
2nd Generation Intel® Xeon® Scalable Processors
Intel® Compute Module HNS2600BPS24R
(1) 2U Chassis (24x2.5") H2224XXLR3
(4) Compute Module (w/TPM 2.0, 2x10GbE SFP+ & 1GbE, RDMA) HNS2600BPS24R
(8) Intel® Xeon Gold 5218R processor (20 Cores, 2.1Ghz, 125W ) CD8069504446300
(4) Intel® Solid State Drive (SSD) DC P4101 256GB (M.2, 80mm NVMe) SSDPEKKA256G801
(24) Intel® Solid State Drive (SSD) D3 S4510 1.92TB (2.5" U.2 SATA) SSDSC2KB019T801
(4) Bridge Board - 12G, IT mode only AHWBPBGB24
(4) Intel® Remote Management Module Lite 2 accessory key AXXRMM4LITE2
(32) 32GB Micron* DDR4 RDIMM, 288-pin, 2666MHz (8 DIMMs per node/32 DIMMs per system)
(2) Power cable FPWRCABLENA (Only for systems shipped to USA & Canada)
Intel® Data Center Blocks for Microsoft* Azure* Stack HCI includes Server Board, Chassis, Processor, Solid State Drives and third-party memory, optimized for Storage Spaces Direct and built with Microsoft* Windows* Server 2019 certified ingredients
Ordering and Compliance
Ordering and spec information
Intel® Server System MCB2224BPAF3R, Single
- MM# 99A3JR
- Ordering Code MCB2224BPAF3R
Trade compliance information
- ECCN 5A002U
- CCATS G157815L1
- US HTS 8471500150
Drivers and Software
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Latest Drivers & Software
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
ISV Certification indicates that the product has been pre-certified by Intel for the specified Independent Software Vendor software.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.