Intel® Server System MCB2208WFAF4R
Specifications
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Essentials
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Product Collection
Intel® Data Center Systems for HCI, certified for Microsoft Azure Stack HCI
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Code Name
Products formerly Wolf Pass
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Launch Date
Q2'19
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Marketing Status
Discontinued
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Expected Discontinuance
2023
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ISV Certification
Microsoft Windows Server 2019* Software-Defined Data Center (SDDC) Premium
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Rack Rails Included
No
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Compatible Product Series
2nd Generation Intel® Xeon® Scalable Processors
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TDP
125 W
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System Board
Intel® Server System R2208WF0ZSR
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Target Market
Cloud/Datacenter
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Supplemental Information
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Description
Intel® Data Center Blocks for Microsoft* Azure* Stack HCI includes Server Board, Chassis, Processor, Solid State Drives and third-party memory, optimized for Storage Spaces Direct and built with Microsoft* Windows* Server 2019 certified ingredients
Memory & Storage
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Storage Profile
All-Flash Storage Profile
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Included Memory
384GB DDR4 RAM Raw Memory
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Included Storage
11.52TB Raw Storage (0.48TB boot device, 3.2TB Cache Tier, 11.52TB Capacity Tier)
Ordering and Compliance
Drivers and Software
Description
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Latest Drivers & Software
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
ISV Certification
ISV Certification indicates that the product has been pre-certified by Intel for the specified Independent Software Vendor software.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Storage Profile
Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.
Included Memory
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.