Intel® Server System VRN2224BPHY4R
Compare Intel® Products
Intel® Data Center Systems for HCI, certified for VMware vSAN
Products formerly Buchanan Pass
Designed for VMware* Virtual SAN (VSAN)
Rack Rails Included
Compatible Product Series
2nd Generation Intel® Xeon® Scalable Processors
Intel® Compute Module HNS2600BPS24R
(1) 2U Chassis (24x2.5") H2224XXLR3
(4) Compute Module (w/TPM 2.0, 2x10GbE SFP+ & 2x1GbE ,RDMA) HNS2600BPS24R
(8) Intel® Xeon® Gold 5215 processor (10 Cores, 2.5GHz, 85W ) CD8069504214002
(4) Bridge Board - 12G, IT mode-only AHWBPBGB24
(4) Intel® Remote Management Module Lite 2 Accessory Key AXXRMM4LITE2
(4) Intel® Solid State Drive (SSD) DC P4101 256GB (M.2 80mm NVMe) SSDPEKKA256G801
(4) Intel® Solid State Drive (SSD) D3 S4610 960GB (2.5" U.2 SATA) SSDSC2KG960G801
(16) Micron* RDIMM 32GB – DDR4, 288-pin, 2666MHz (8) DIMMs per node/32 DIMMs per system) J47951-001
(2) Power cable FPWRCABLENA (Only for systems shipped to USA & Canada)
Intel® Data Center Blocks for Cloud designed for VMware* Virtual SAN (vSAN) includes Server Board, Chassis, Processor, Solid State Drives and third-party memory
Memory & Storage
Hybrid Storage Profile
512GB DDR4 RAM Raw Memory
4 x 0.25TB boot device 3.84TB Cache Tier Capacity Tier HDDs are customer supplied and NOT INCLUDED in the configuration. This model was certified with 16 x 1TB Seagate ST1000NX0453 drives
Ordering and Compliance
Ordering and spec information
Intel® Server System VRN2224BPHY4R, Single
- MM# 999KFH
- Ordering Code VRN2224BPHY4R
Trade compliance information
- ECCN 5A002U
- CCATS G157815L1
- US HTS 8471500150
Drivers and Software
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Latest Drivers & Software
Intel® Configuration Detector for Linux*
A Linux script that collects the hardware and software configuration of an x86 system without additional software installation.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
ISV Certification indicates that the product has been pre-certified by Intel for the specified Independent Software Vendor software.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
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Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.