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  • Brand Name: Core i7

  • Product Number: i7-7500U

  • Ordering Code: SC3120AKIT

  • SPEC Code: SR2PA

  • Code Name: Kaby Lake

Intel® Server System S9232WK2HLC Compute Module

Intel® Server System S9232WK2HLC Compute Module

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Specifications

Export specifications

Essentials

Supplemental Information

  • Description S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon®
    Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000.

Expansion Options

Package Specifications

  • Max CPU Configuration 2

Advanced Technologies

Intel® Transparent Supply Chain

Ordering and Compliance

Ordering and spec information

Intel® Server System S9232WK2HLC Compute Module, Single

  • MM# 999DA1
  • Ordering Code S9232WK2HLC

Trade compliance information

  • ECCN 5A002U*
  • CCATS G157815L1
  • US HTS 8471500150

Product Images

Product Images

Compatible Products

6th Generation Intel® Core™ i7 Processors

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2nd Generation Intel® Xeon® Scalable Processors

Product Name Status Launch Date # of Cores Max Turbo Frequency Processor Base Frequency Cache Processor Graphics ‡ Recommended Customer Price SortOrder Compare
All | None
Intel® Xeon® Platinum 9222 Processor Launched Q3'19 32 3.70 GHz 2.30 GHz 71.5 MB

Intel® Server Chassis FC2000 Family

Product Name Status Chassis Form Factor SortOrder Compare
All | None
Intel® Server Chassis FC2HLC21W3 Launched 2U Front IO, 4 node Rack

Management Module Options

Product Name Status SortOrder Compare
All | None
EMP Module AXXFCEMP Launched

Rail Options

Product Name Status SortOrder Compare
All | None
2U Chassis Fixed External Rail Kit FCXXRAILKIT Launched

Spare Cable Options

Product Name Status SortOrder Compare
All | None
I/O Breakout cable spare kit AXXCONNTDBG Launched

Spare Heat-Sink Options

Product Name Status SortOrder Compare
All | None
2U Passive Heat Sink FXXWKHS Launched
Liquid-Cooling Loop DIMM TIMM FXXWKLCDMTM Launched
Liquid-Cooling Loop Kit FXXWKLCLP Launched
Liquid-Cooling Memory Retention Clip FXXWKLCDMCLP Launched
M.2 Heat sink Assembly FXXWKM2HS Launched

Spare Riser Card Options

Product Name Status SortOrder Compare
All | None
2U Spare PCIe Riser (Two x16 PCIe slots, M.2 Connector and U.2 Adapter Card Connector) FXXWK2URISER Launched

Intel® Ethernet Network Adapter XXV710 Series

Product Name Status Embedded Options Available Cabling Type TDP Recommended Customer Price Port Configuration Data Rate Per Port System Interface Type SortOrder Compare
All | None
Intel® Ethernet Network Adapter XXV710-DA1 Launched SFP28 Direct Attach twinaxial cabling up to 5m / SFP28 SR and LR Optics also supported Single 25/10/1GbE PCIe v3.0 (8.0 GT/s)
Intel® Ethernet Network Adapter XXV710-DA2 Launched SFP28 Direct Attach twinaxial cabling up to 5m / SFP28 SR & LR Optics also supported Dual 25/10/1GbE PCIe v3.0 (8.0 GT/s)

Intel® Ethernet Server Adapter XL710 Series

Product Name Status Embedded Options Available Cabling Type TDP Recommended Customer Price Port Configuration Data Rate Per Port System Interface Type SortOrder Compare
All | None
Intel® Ethernet Converged Network Adapter XL710-QDA2 Launched QSFP+ Direct Attach Cabling up to 10m Dual 40/10GbE PCIe v3.0 (8.0 GT/s)
Intel® Ethernet Converged Network Adapter XL710-QDA1 Launched QSFP+ Direct Attach Twinaxial Cabling up to 10m Single 40/10GbE PCIe v3.0 (8.0 GT/s)

Intel® Ethernet Network Adapter X710 Series

Product Name Status Embedded Options Available Cabling Type TDP Recommended Customer Price Port Configuration Data Rate Per Port System Interface Type SortOrder Compare
All | None
Intel® Ethernet Converged Network Adapter X710-DA2 Launched SFP+ Direct Attached Twinaxial Cabling up to 10m Dual 10/1GbE PCIe v3.0 (8.0 GT/s)

Intel® Ethernet Converged Network Adapter X550 Series

Product Name Status Embedded Options Available Cabling Type TDP Recommended Customer Price Port Configuration Data Rate Per Port System Interface Type Jumbo Frames Supported SortOrder Compare
All | None
Intel® Ethernet Converged Network Adapter X550-T2 Launched RJ45 Category 6 up to 55m; Category 6A up to 100m Dual 10GbE/5GbE/2.5GbE/1GbE/100Mb PCIe v3.0 (8.0 GT/s)
Intel® Ethernet Converged Network Adapter X550-T1 Launched RJ45 Category 6 up to 55m; Category 6A up to 100m Single 10GbE/5GbE/2.5GbE/1GbE/100Mb PCIe v3.0 (8.0 GT/s)

Intel® Optane™ SSD DC P4800X Series

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Intel® Optane™ SSD DC P4800X Series (1.5TB, 2.5in PCIe x4, 3D XPoint™) 1.5 TB Launched U.2 15mm PCIe 3.0 x4, NVMe
Intel® Optane™ SSD DC P4800X Series (750GB, 2.5in PCIe x4, 3D XPoint™) 750 GB Launched U.2 15mm PCIe 3.0 x4, NVMe
Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in PCIe x4, 3D XPoint™) 375 GB Launched U.2 15mm PCIe 3.0 x4, NVMe

Intel® SSD D3-S4510 Series

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Intel® SSD D3-S4510 Series (960GB, M.2 80mm SATA 6Gb/s, 3D2, TLC) 960 GB Launched M.2 22 x 80mm SATA 3.0 6Gb/S
Intel® SSD D3-S4510 Series (480GB, M.2 80mm SATA 6Gb/s, 3D2, TLC) 480 GB Launched M.2 22 x 80mm SATA 3.0 6Gb/S
Intel® SSD D3-S4510 Series (240GB, M.2 80mm SATA 6Gb/s, 3D2, TLC) 240 GB Launched M.2 22 x 80mm SATA 3.0 6Gb/S

Intel® SSD DC P4610 Series

Product Name Capacity Status Form Factor Interface SortOrder Compare
All | None
Intel® SSD DC P4610 Series (7.6TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 7.68 TB Launched U.2 15mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4610 Series (6.4TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 6.4 TB Launched U.2 15mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4610 Series (3.2TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 3.2 TB Launched U.2 15mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4610 Series (1.6TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 1.6 TB Launched U.2 15mm PCIe 3.1 x4, NVMe

Intel® SSD DC P4511 Series

Product Name Capacity Status Form Factor Interface SortOrder Compare
All | None
Intel® SSD DC P4511 Series (2.0TB, M.2 110mm PCIe 3.1 x4, 3D2, TLC) 2 TB Launched M.2 22 x 110mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4511 Series (1.0TB, M.2 110mm PCIe 3.1 x4, 3D2, TLC) 1 TB Launched M.2 22 x 110mm PCIe 3.1 x4, NVMe

Intel® SSD DC P4510 Series

Product Name Capacity Status Form Factor Interface SortOrder Compare
All | None
Intel® SSD DC P4510 Series (8.0TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 8 TB Launched U.2 15mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4510 Series (4.0TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 4 TB Launched U.2 15mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4510 Series (1.0TB, 2.5in PCIe 3.1 x4, 3D2, TLC) 1 TB Launched U.2 15mm PCIe 3.1 x4, NVMe

Intel® SSD DC P4101 Series

Product Name Capacity Status Form Factor Interface SortOrder Compare
All | None
Intel® SSD DC P4101 Series (2.048TB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) 2 TB Launched M.2 22 x 80mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4101 Series (1.024TB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) 1 TB Launched M.2 22 x 80mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4101 Series (512GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) 512 GB Launched M.2 22 x 80mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4101 Series (256GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) 256 GB Launched M.2 22 x 80mm PCIe 3.1 x4, NVMe
Intel® SSD DC P4101 Series (128GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) 128 GB Launched M.2 22 x 80mm PCIe 3.1 x4, NVMe

Intel® SSD DC P3100 Series

Product Name Capacity Status Form Factor Interface SortOrder Compare
All | None
Intel® SSD DC P3100 Series (1.0TB, M.2 80mm PCIe 3.0 x4, 3D1, TLC) 1 TB Discontinued M.2 22 x 80mm PCIe 3.0 x4, NVMe
Intel® SSD DC P3100 Series (512GB, M.2 80mm PCIe 3.0 x4, 3D1, TLC) 512 GB Discontinued M.2 22 x 80mm PCIe 3.0 x4, NVMe
Intel® SSD DC P3100 Series (256GB, M.2 80mm PCIe 3.0 x4, 3D1, TLC) 256 GB Discontinued M.2 22 x 80mm PCIe 3.0 x4, NVMe
Intel® SSD DC P3100 Series (128GB, M.2 80mm PCIe 3.0 x4, 3D1, TLC) 128 GB Discontinued M.2 22 x 80mm PCIe 3.0 x4, NVMe

Drivers and Software

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Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Intel® Optane™ DC Persistent Memory Supported

Intel® Optane™ DC persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane DC persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.