Intel® Server System S9232WK1HLC Compute Module
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Intel® Server System S9200WK Family
Products formerly Walker Pass
Limited 3-year Warranty
Supported Operating Systems
Red Hat Enterprise Linux 7.6*, SUSE Linux Enterprise Server 12 SP4*, CentOS 7.4*
Board Form Factor
8.33” x 21.5”
Chassis Form Factor
2U Rack front IO
Integrated Systems Available
Integrated BMC with IPMI
(1) Server board
(1) 1U compute module tray
(2) Intel® Xeon® Platinum 9222 Processor
2) 1U riser assembly
(1) Liquid cooling loop kit
Intel® C621 Chipset
High Performance Computing
S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon®
Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000.
Max CPU Configuration
Intel® Transparent Supply Chain
Ordering and Compliance
Ordering and spec information
Intel® Server System S9232WK1HLC Compute Module, Single
- MM# 999D9W
- Ordering Code S9232WK1HLC
Trade compliance information
- ECCN 5A002U
- CCATS G157815L1
- US HTS 8471500150
2nd Generation Intel® Xeon® Scalable Processors
6th Generation Intel® Core™ i7 Processors
Intel® Server Chassis FC2000 Family
Management Module Options
Spare Cable Options
Spare Chassis Maintenance Options
Spare Heat-Sink Options
Spare Riser Card Options
Intel® Ethernet Network Adapter XXV710 Series
Intel® Ethernet Server Adapter XL710 Series
Intel® Ethernet Network Adapter X710 Series
Intel® Ethernet Converged Network Adapter X550 Series
Intel® Optane™ DC SSD Series
Intel® SSD D3 Series
Intel® SSD D1 Series
Intel® SSD DC P4511 Series
Intel® SSD DC P4510 Series
Intel® SSD DC P3100 Series
Drivers and Software
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The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
PCIe x16 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.