Intel® Compute Module HNS2600BPB24R
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Intel® Server System S2600BP Family
Products formerly Buchanan Pass
Limited 3-year Warranty
Extended Warranty Available for Purchase (Select Countries)
Additional Extended Warranty Details
Intel® Compute Module HNS2000 Extended Warranty
# of QPI Links
Compatible Product Series
2nd Generation Intel® Xeon® Scalable Processors
Supported Operating Systems
VMware*, Windows Server 2019*, Windows Server 2016*, Red Hat Enterprise Linux 7.6*, Red Hat Enterprise Linux 7.5*, SUSE Linux Enterprise Server 15*, SUSE Linux Enterprise Server 12 SP4*, Ubuntu*
Board Form Factor
Custom 6.8" x 19.1"
Chassis Form Factor
Integrated Systems Available
Integrated BMC with IPMI
IPMI 2.0 & Redfish
(1) 1U node tray
(1) Intel® Server Board S2600BPBR
(1) Power Docking Board FHWBPNPB24
(3) 40x56mm dual rotor managed fans FXX4056DRFAN2
(1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS
(1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS
(1) Air duct
(1) External VGA port bracket
(1) Slot 1 riser card
(1) Slot 2 riser card w/80mm M.2 SSD slot.
Required Items – Sold Separately:
(1) bridge board option - AHWBPBGB24, AHWBPBGB24R OR AHWBPBGB24P;
(1) or (2) 2nd Generation Intel® Xeon® Scalable Processors,
Up to (16) DDR4 RDIMM/LRDIMM
Intel® C621 Chipset
High Performance Computing
Max CPU Configuration
Intel® Transparent Supply Chain
Includes Statement of Conformance and Platform Certificate
Ordering and Compliance
2nd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Scalable Processors
Intel® RAID Controllers
Intel® RAID Premium Features
Intel® RAID Software
Intel® Virtual RAID on CPU (Intel® VROC)
Management Module Options
Riser Card Options
Spare Board Options
Spare Fan Options
Spare Heat-Sink Options
Intel® Server Component Extended Warranty
Intel® Ethernet Network Adapter XXV710
Intel® Ethernet Server Adapter XL710
Intel® Ethernet Network Adapter X722
Intel® Ethernet Network Adapter X710
Intel® Ethernet Converged Network Adapter X550
Intel® Optane™ DC SSD Series
Intel® SSD D5 Series
Intel® SSD D3 Series
Intel® Optane™ Persistent Memory
Intel® SSD DC P4618 Series
Intel® SSD DC S3520 Series
Intel® SSD DC P4610 Series
Intel® SSD DC P4600 Series
Intel® SSD DC P4510 Series
Intel® SSD DC P4501 Series
Intel® SSD DC P4500 Series
Intel® SSD DC P3520 Series
Intel® SSD DC P3100 Series
Intel® Data Center Manager
Intel® Omni-Path Host Fabric Interface PCIe Adapter 100 Series
Drivers and Software
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The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output defines the interfaces available to communicate with display devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.