Intel® Server System ZSB2224BPAF2

Specifications

  • Product Collection Intel® Data Center Blocks for Cloud (Intel® DCB for Cloud)
  • Code Name Products formerly Buchanan Pass
  • Launch Date Q3'18
  • Marketing Status Discontinued
  • Expected Discontinuance Q1'19
  • EOL Announce Friday, March 8, 2019
  • Last Order Friday, March 8, 2019
  • Last Receipt Attributes Friday, March 8, 2019
  • Limited 3-year Warranty Yes
  • Chassis Form Factor 2U, 4 node Rack Chassis
  • Chassis Dimensions 3.46" x 17.24" x 28.86"
  • Socket Socket P
  • TDP 140 W
  • Heat Sink (4) 1U passive heat sink – CPU #1 – CuAL – FXXHP78X108HS
    (4) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS

  • Heat Sink Included Yes
  • System Board Intel® Server Board S2600BPS
  • Board Chipset Intel® C622 Chipset
  • Target Market Cloud/Datacenter
  • Rack-Friendly Board Yes
  • Power Supply 2130 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans Yes
  • Redundant Power Supported Yes
  • Backplanes Included
  • Included Items (1) Intel® Server Chassis H2224XXLR3 (24x2.5" U.2 Drives)
    (4) Intel® Server Node HNS2600BPS24
    (8) Intel® Xeon® Gold 6140 Processor (18 Cores, 2.3 GHz, 140W )
    (64) RDIMM 16GB - DDR4, 288-pin, 2666MHz
    (4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2)
    (16) Intel® SSD D3 S4510 Series (3.8TB, 2.5in SATA 6Gb/s)
    (4) 2x10GbE SFP+ and 2x1GbE RDMA
    (4) Boot Device - Intel® SSD DC P4101 Series (512GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC)
    (4) Remote Management Module Lite 2

Supplemental Information

  • Description All-Flash with Intel® Optane™ SSD, 144 Cores (36/node), 63.8TB raw capacity, 1TB memory (256GB/node)

Memory & Storage

  • Storage Profile All-Flash Storage Profile
  • Included Memory 32X16 GB DDR4 2666MHz
  • Memory Types RDIMM 16GB - DDR4, 288-pin, 2666MHz
  • # of Memory Slots 64
  • Included Storage (4) Intel® Optane™ SSD DC P4800X Series (375GB, 2.5in U.2), (16) Intel® SSD DC S4510 Series (3.8TB, 2.5in SATA 6Gb/s)
  • # of Front Drives Supported 24
  • Front Drive Form Factor Hot-swap 2.5"

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 8

Ordering and Compliance

Retired and discontinued

Intel® Server System ZSB2224BPAF2, Single

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8471500150

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Board S2600BP Family BIOS and Firmware Update Package for UEFI

Intel® Configuration Detector for Linux*

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Included Memory

Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.