Intel® Server System R1304WFTZSR

Specifications

  • Product Collection Intel® Server System R1000WFR Family
  • Code Name Products formerly Wolf Pass
  • Launch Date Q1'22
  • Status Launched
  • Expected Discontinuance 2023
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Dual Processor System Extended Warranty
  • Supported Operating Systems VMware*, Windows Server 2019*, Red Hat Enterprise Linux 7.6*, Red Hat Enterprise Linux 7.5*, SUSE Linux Enterprise Server 15*, SUSE Linux Enterprise Server 12 SP4*, Ubuntu*
  • Chassis Form Factor 1U, Spread Core Rack
  • Chassis Dimensions 16.93" x 27.95" x 1.72"
  • Board Form Factor Custom 16.7" x 17"
  • Compatible Product Series 2nd Generation Intel® Xeon® Scalable Processors
  • Socket Socket P
  • TDP 165 W
  • Heat Sink (2) 1U Standard Heat Sink FXXCA78X108HS
  • Heat Sink Included Yes
  • System Board Intel® Server Board S2600WFTR
  • Board Chipset Intel® C624 Chipset
  • Target Market Mainstream
  • Rack-Friendly Board Yes
  • Power Supply 1300 W
  • Power Supply Type AC
  • # of Power Supply Included 1
  • Redundant Power Supported Supported, requires additional power supply
  • Backplanes Included
  • Included Items (1) 1U chassis with Quick Reference Label
    (1) Intel® Server Board S2600WFTR
    (2) Riser card assembly with 1 slot PCIe* x16 riser card F1UL16RISER3
    (4) 3.5” hot-swap drive bays with drive carriers and drive blanks
    (1) Preinstalled standard control panel assembly
    (board only FXXFPANEL2)
    (1) Preinstalled front I/O panel assembly (1 x VGA and 2 x USB)
    (1) 150 mm backplane I2C cable H91171-xxx
    (1) 850 mm mini SAS HD cable AXXCBL850HDHRT
    (1) 350 mm backplane power cable H82100-xxx
    (1) SATA optical drive power cable 300 mm H23901-001
    (1) SATA optical drive bay mounting kit H19168-xxx
    (1) Air duct H90054-xxx
    (6) Dual rotor system fans FR1UFAN10PW
    (1) 1300W power supply module AXX1300TCRPS
    (2) CPU heat sinks J39509-xxx
    (2) CPU heat sink “No CPU” label inserts J16115-xxx
    (2) Standard CPU Carriers H72851-xxx
    (8) DIMM slot blanks G75158-xxx
    (1) Chassis Stiffener Bar J16623-xxx
    (1) Power supply bay blank insert
    (2) AC power cord retention strap assembly H23961-00x

Supplemental Information

  • Description Integrated 1U system featuring an Intel® Server Board S2600WFTR with Dual 10GbE LAN, supporting two 2nd Generation Intel® Xeon® Scalable processors, (4) 3.5 inch hot-swap drives, 24 DIMMs, (1)1300W redundant-capable power supply, Intel® OCP Module.

Memory & Storage

Processor Graphics

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Intel® Transparent Supply Chain

  • Includes Statement of Conformance and Platform Certificate Yes

Ordering and Compliance

Ordering and spec information

Intel® Server System R1304WFTZSR, Single

  • MM# 99AW7M
  • Ordering Code R1304WFTZSR

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8473305100

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Linux*

Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) Mount Clean Script

Intel® Virtual RAID on CPU (Intel® VROC) and Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 62X Chipset

Save and Restore System Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems Based on Intel® 62X Chipset

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe OCuLink Connectors (NVMe support)

Onboard PCIe OCuLink connectors provide direct-attach NVMe SSD support.

Connector for Intel® Integrated RAID Module

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Riser Slot 1: Included Slot Configuration(s)

This is the configuration of the installed riser card for this specific slot for systems that ship with risers pre-installed.

Riser Slot 2: Included Slot Configuration(s)

This is the configuration of the installed riser card for this specific slot for systems that ship with risers pre-installed.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.