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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Server System LSP2D2ZS568202

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server System R2600SR Family
  • Code Name Products formerly Buchanan Pass
  • Launch Date Q1'18
  • Marketing Status Discontinued
  • Expected Discontinuance Q3'19
  • EOL Announce Friday, June 7, 2019
  • Last Order Thursday, August 22, 2019
  • Last Receipt Attributes Sunday, December 22, 2019
  • Limited 3-year Warranty Yes
  • Chassis Form Factor 2U, 4 node Rack Chassis
  • Chassis Dimensions 19.3" x 35.1" x 3.5"
  • Rack Rails Included Yes
  • Compatible Product Series Intel® Xeon® Scalable Processors
  • Socket Socket P
  • TDP 205 W
  • Heat Sink 8
  • Heat Sink Included Yes
  • System Board Intel® Server System R2600SR Family
  • Board Chipset Intel® C624 Chipset
  • Target Market High Performance Computing
  • Rack-Friendly Board Yes
  • Power Supply 2000 W
  • Power Supply Type AC
  • # of Power Supply Included 2
  • Redundant Fans Yes
  • Redundant Power Supported Yes
  • Backplanes Included
  • Included Items 1) 2U Chassis
    (1) Rack Mount Rail Kit
    (1) System Management Module (SMM)
    (2) 2000WAC Platinum Power Supply Unit (PSU)
    (2) Power cords (1.5m, 10A/100-250V,
    (4) Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x16
    (1) 10GB 8-port Ethernet I/O Module (EIOM) Base-T RJ45
    (2) 80mm x 80mm x 80mm cooling fans
    (3) 60mm x 60mm x 56mm cooling fans
    (1) KVM System Console Breakout Cable
    (4) Compute Node (includes the following)
    •(8) Intel® Xeon® Platinum 8168 Processor
    •(4) 105mm CPU1 Heatsink (1 per compute node)
    •(4) 85mm CPU 2 Heatsink )
    •(8) 4R Heatsink Clips
    •(48) 32GB DDR4 2667 RDIMMs
    •(4) Intel® SSD DC S4600 Series (1.9TB, 2.5in SATA 6Gb/s)
    •(16) Drive Blanks
    •(4) VGA/USB KVM
    •(4) Node Control Panel

Supplemental Information

  • Description 2U 4N Intel® Server System R2600SR to support Intel® Xeon® Platinum 8168 processors.

Memory & Storage

Processor Graphics

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 8

Advanced Technologies

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Intel® Configuration Detector for Linux*

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Included Memory

Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.