Intel® Ethernet Connection C827-AM1
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Data Rate Per Port
SFI, KR, KR4, XAUI, KX, SGMII, XLAUI, KR2, CR2, CR4, CAUI, CPRI
14mm x 14mm
Ordering and Compliance
Ordering and spec information
Intel® Ethernet Connection C827-AM1, Tray
- MM# 954452
- Spec Code SLM2Q
- Ordering Code EZC827AM
- Stepping A1
Intel® Ethernet Connection C827-AM1, T&R
- MM# 954453
- Spec Code SLM2R
- Ordering Code EZC827AM
- Stepping A1
Trade compliance information
- ECCN 5A991
- CCATS NA
- US HTS 8542310001
- 954453 PCN
Drivers and Software
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Latest Drivers & Software
Intel® Ethernet Adapter Complete Driver Pack
This download installs version 26.8 of the Intel® Ethernet Adapter Complete Driver Pack for supported OS versions.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.