Intel® Ethernet Connection C827-AM1
Specifications
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Essentials
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Product Collection
Intel® Ethernet Connection C827 Series
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Code Name
Products formerly Parkvale
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Marketing Status
Launched
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Launch Date
Q3'17
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Expected Discontinuance
1H'29
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TDP
2.6 W
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Operating Temperature Range
0°C to 70°C
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Operating Temperature (Maximum)
70 °C
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Operating Temperature (Minimum)
0 °C
Supplemental Information
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Embedded Options Available
No
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Datasheet
View now
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Description
The Intel C827-AM device is a fully integrated single chip Ethernet transceiver that
supports 25GbE full-duplex transmission, over a variety of media including optics, passive copper
cables and backplanes.
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Product Brief
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Networking Specifications
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Port Configuration
Quad
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Data Rate Per Port
25GbE
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Interfaces Supported
SFI, KR, KR4, XAUI, KX, SGMII, XLAUI, KR2, CR2, CR4, CAUI, CPRI
Package Specifications
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Package Size
14mm x 14mm
Ordering and Compliance
Drivers and Software
Description
Type
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OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® Ethernet Adapter Complete Driver Pack
Adapter User Guide for Intel® Ethernet Adapters
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.