Passive/Active Combination Heat-Sink with Removable Fan BXSTS300C

Specifications

  • Product Collection Heat-Sink Options
  • Status Launched
  • Launch Date Q3'17
  • Expected Discontinuance 2023
  • EOL Announce Thursday, March 11, 2021
  • Last Order Friday, October 1, 2021
  • Last Receipt Attributes Wednesday, December 1, 2021
  • Included Items Passive/Active Heat-Sink for LGA3647 socket

Supplemental Information

  • Description Passive/Active Heat-sink solutions for LGA3647 Socket. 91x88x64 mm. Support for up to 280W.

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.