Passive Thermal Solution BXSTS300P


  • Product Collection Heat-Sink Options
  • Marketing Status Discontinued
  • Launch Date Q3'17
  • Expected Discontinuance 2023
  • EOL Announce Thursday, March 11, 2021
  • Last Order Friday, October 1, 2021
  • Last Receipt Attributes Wednesday, December 1, 2021
  • Included Items Passive Heat-Sink for LGA3647 socket
  • New Design Availability Expiration Date Monday, July 11, 2022

Supplemental Information

  • Description Passive Heat-sink solution for LGA3647 socket. Supports up to 135 Watts.

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.