Intel® QuickAssist Adapter 8970

Specifications

  • Product Collection I/O Options
  • Status Launched
  • Launch Date Q2'18
  • TDP 23 W
  • Supported Operating Systems Linux*
  • Operating Temperature Range 50°C to 0°C

Supplemental Information

Networking Specifications

  • Data Rate Per Port Up to 100G

Package Specifications

  • Board Form Factor PCIe
  • Package Size 2.7" x 6.6"
  • Low Halogen Options Available No

Intel® Virtualization Technology for Connectivity

Advanced Technologies

Ordering and Compliance

Ordering and spec information

Intel® QuickAssist Adapter 8970, 5 Pack

  • Ordering Code IQA89701G1P5

Trade compliance information

  • ECCN 5A002R
  • CCATS G171158L2
  • US HTS 8471801000

PCN/MDDS Information

Downloads and Software

Launch Date

The date the product was first introduced.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

PCI-SIG* SR-IOV Capable

Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.

Intel® Data Direct I/O Technology

Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.