Intel® QuickAssist Adapter 8960
Specifications
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Essentials
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Product Collection
Accelerator Options
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Marketing Status
Launched
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Launch Date
Q2'18
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TDP
21 W
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Supported Operating Systems
Linux*
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Operating Temperature Range
50°C to 0°C
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Operating Temperature (Maximum)
0 °C
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Operating Temperature (Minimum)
50 °C
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Supplemental Information
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Embedded Options Available
No
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Description
ACCEL CARD x8
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Product Brief
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Networking Specifications
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Data Rate Per Port
Up to 50G
Package Specifications
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Board Form Factor
PCIe
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Package Size
2.7" x 6.6"
Intel® Virtualization Technology for Connectivity
Advanced Technologies
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Intel® Data Direct I/O Technology
Yes
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Intelligent Offloads
Yes
Ordering and Compliance
Drivers and Software
Description
Type
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Version
Date
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Latest Drivers & Software
Name
Intel® QuickAssist Technology Driver for Linux* – HW Version 1.X
Intel® QuickAssist Technology Driver for Windows* – HW Version 1.X
Intel® QuickAssist Technology Driver for VMware* – HW Version 1.X
Intel® QuickAssist Technology Driver for FreeBSD* - HW Version 1.X
Support
Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
PCI-SIG* SR-IOV Capable
Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.
Intel® Data Direct I/O Technology
Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.