Intel® NUC Kit NUC7i3BNHX1 with Intel® Optane™ Memory
Specifications
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Essentials
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Product Collection
Intel® NUC Kit with 7th Generation Intel® Core™ Processors
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Code Name
Products formerly Baby Canyon
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Processor Included
Intel® Core™ i3-7100U Processor (3M Cache, 2.40 GHz)
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Board Number
NUC7i3BNB
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Supported Operating Systems
Windows 10, 64-bit*
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Supplemental Information
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Marketing Status
End of Support
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Launch Date
Q2'17
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Warranty Period
3 yrs
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Embedded Options Available
No
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Datasheet
View now
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Description
Other features: includes USB 3.1 Gen 2 (10Gbps) and DP 1.2 via USB-C; also includes microSDXC card slot, dual microphones
CPU Specifications
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Total Cores
2
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Total Threads
4
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Processor Base Frequency
2.40 GHz
Memory & Storage
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Included Storage
16GB Intel® Optane™ Memory M.2 module pre-installed
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Max Memory Size (dependent on memory type)
32 GB
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# of Memory Slots
2
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Memory Types
DDR4-2133 1.2V SO-DIMM
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Max # of Memory Channels
2
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Max Memory Bandwidth
34.1 GB/s
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ECC Memory Supported ‡
No
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# of Internal Drives Supported
1
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Removable Memory Card Slot
Micro SDXC with UHS-I support
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M.2 Card Slot (storage)
22x42/80
I/O Specifications
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Graphics Output
HDMI 2.0a; USB-C (DP1.2)
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# of Displays Supported ‡
3
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# of Thunderbolt™ Ports
0
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# of USB Ports
6
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USB Configuration
2x front and 2x rear USB 3.0; 2x USB 2.0 via internal headers
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USB Revision
2.0, 3.0
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USB 2.0 Configuration (External + Internal)
0 + 2
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USB 3.0 Configuration (External + Internal)
2B 2F + 0
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Total # of SATA Ports
2
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Max # of SATA 6.0 Gb/s Ports
2
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Audio (back channel + front channel)
7.1 digital (HDMI mDP); L+R+mic (F)
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Integrated LAN
Intel® Ethernet Connection I219-V
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Wireless Included
Intel® Dual Band Wireless-AC 8265
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Bluetooth Version
4.2
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Consumer Infrared Rx Sensor
Yes
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Additional Headers
CEC, 2x USB2.0, FRONT_PANEL
Expansion Options
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PCI Express Revision
Gen3
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PCI Express Configurations ‡
M.2 slot with PCIe x4 lanes
Package Specifications
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TDP
15 W
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DC Input Voltage Supported
12-19 VDC
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Board Form Factor
UCFF (4" x 4")
Security & Reliability
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Support
Launch Date
The date the product was first introduced.
Warranty Period
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Removable Memory Card Slot
Removable Card Slot indicates the presence of a slot for removable memory cards.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
# of Thunderbolt™ Ports
Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Bluetooth Version
Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.
Consumer Infrared Rx Sensor
Indicates presence of an infrared receiver sensor on Intel® NUC products, or capability of previous Intel® Desktop Boards to accept infrared receiver sensor via header.
Additional Headers
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Platform Trust Technology (Intel® PTT)
Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.
TPM
Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.