Intel® NUC 12 Pro Kit NUC12WSKi70Z
Specifications
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Essentials
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Product Collection
Intel® NUC Kit with 12th Generation Intel® Core™ Processors
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Code Name
Products formerly Wall Street Canyon
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Processor Included
Intel® Core™ i7-1260P Processor (18M Cache, up to 4.70 GHz)
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Board Number
NUC12WSBi70Z
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Supported Operating Systems
Windows 11 Home*, Windows 11 Pro*, Windows 10 Home*, Windows 10 IoT Enterprise*, Windows 10 Pro*, Red Hat Linux*, Ubuntu 20.04 LTS*
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Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q3'22
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Expected Discontinuance
1H'25
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Embedded Options Available
No
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Included Items
VESA bracket
CPU Specifications
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Total Cores
12
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Total Threads
16
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Max Turbo Frequency
4.70 GHz
Memory & Storage
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Max Memory Size (dependent on memory type)
64 GB
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# of Memory Slots
2
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Memory Types
DDR4-3200 1.2V SODIMMs
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Max # of Memory Channels
2
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ECC Memory Supported ‡
No
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Internal Drive Form Factor
M.2 SSD
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# of Internal Drives Supported
2
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M.2 Card Slot (storage)
22x80 NVMe (M); 22x42 SATA (B)
I/O Specifications
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Graphics Output
2x HDMI 2.1 TMDS Compatible
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# of Displays Supported ‡
2
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# of USB Ports
4
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USB Configuration
Front: 2x USB 3.2
Rear: 1x USB 3.2, 1x USB 2.0
Internal: 1x USB 3.2 on m.2 22x42 (pins), 2x USB 2.0 (headers)
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Serial Port via Internal Header
No
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Audio (back channel + front channel)
Front panel: 3.5mm headphone/mic jack
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Integrated LAN
Intel® Ethernet Controller i225-V
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Wireless Included
Intel® Wi-Fi 6E AX211 (Gig+)
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Bluetooth Version
5.3
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M.2 Card Slot (wireless)
22x30 (E)
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Additional Headers
Front_panel (PWR, RST, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector
Expansion Options
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PCI Express Revision
Gen 4 (m.2 22x80 slot); Gen 3 (otherwise)
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PCI Express Configurations ‡
PCIe x4 Gen 4: M.2 22x80 (key M)
PCIe x1 Gen 3: M.2 22x42 (key B)
PCIe x1: M.2 22x30 (key E)
Package Specifications
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TDP
35 W
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DC Input Voltage Supported
12-20 VDC
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Chassis Dimensions
117 x 112 x 37 [mm] (LxWxH)
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Board Form Factor
UCFF (4" x 4")
Advanced Technologies
Security & Reliability
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
BIOS Update [WSADL357]
Intel® Aptio* V UEFI Firmware Integrator Tools for Intel® NUC
Intel® Graphics DCH Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Intel® Wireless Bluetooth® Driver for Windows® 10 64-Bit and Windows 11* for Intel® NUC Kits & Mini PCs
Intel® Wireless Technology-Based Driver for Windows® 10 64-bit & Windows* 11 for Intel® NUC Kits & Mini PCs
Intel® Chipset Device Software for Windows® 10 64-bit and Windows 11* for Intel® NUC Kits & Mini PCs 7th Generation and Later
Intel® NUC Pro Software Suite (NPSS) Version 2
Realtek* High Definition Audio Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC12 Pro Kits & Mini PCs - NUC12WS
Intel® Rapid Storage Technology Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Intel® Serial IO Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Intel® Ethernet (LAN) Network Connection Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Patch for a Modern Standby LAN Issue on Intel® NUC 11th & 12th Generation Products
Intel® GNA Scoring Accelerator Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Intel® Management Engine Consumer Driver for Windows® 10 64-bit and Windows 11* for Intel® NUC 12 Pro Kits & Mini PCs - NUC12WS
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Bluetooth Version
Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.
M.2 Card Slot (wireless)
M.2 Card Slot (wireless) indicates presence of an M.2 slot that's keyed for wireless expansion cards
Additional Headers
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Platform Trust Technology (Intel® PTT)
Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.
Intel® ME Firmware Version
Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.