Compare Intel® Products

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Essentials

Product Collection
Status
Launch Date
Expected Discontinuance
Included Items
Off Roadmap
EOL Announce
Last Order
Last Receipt Attributes
Product Collection
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C Heat-Sink Options Intel® Thermal Solution BXTS13X Boxed Desktop Thermal Solutions Intel® Thermal Solution BXTS13A Boxed Desktop Thermal Solutions Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C Heat-Sink Options
Status
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C Launched Intel® Thermal Solution BXTS13X Discontinued Intel® Thermal Solution BXTS13A Launched Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C Launched
Launch Date
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C Q1'09 Intel® Thermal Solution BXTS13X Q2'13 Intel® Thermal Solution BXTS13A Q2'14 Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C Q4'14
Expected Discontinuance
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C 2012 Intel® Thermal Solution BXTS13X EOL Intel® Thermal Solution BXTS13A None at this time
Included Items
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C (1) Heat-sink with Removable Fan Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C (1) Heat-sink
Off Roadmap
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C No Intel® Thermal Solution BXTS13X No Intel® Thermal Solution BXTS13A No Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C No
EOL Announce
Intel® Thermal Solution BXTS13X Tuesday, August 7, 2018
Last Order
Intel® Thermal Solution BXTS13X Friday, February 8, 2019
Last Receipt Attributes
Intel® Thermal Solution BXTS13X Friday, August 9, 2019

Supplemental Information

Description
Description
Passive/Active Combination Heat-Sink with Removable Fan BXSTS100C Passive/Active Combination Heat-Sink with Removable Fan. Supports processors up to 130W Watts. Intel® Thermal Solution BXTS13X Intel® Thermal Solution BXTS13X, Retail Box (Liquid cooled HEDT thermal solution can be used on LGA2066/LGA2011/LGA1150/LGA1155/LGA1156/LGA1151 Intel® Thermal Solution BXTS13A Intel® Thermal Solution BXTS13A, Retail Box (Air cooled thermal Solution designed for HEDT LGA2011 sockets) Passive/Active Combination Heat-Sink with Removable Fan BXSTS200C Intel Boxed Thermal Solutions, heat sink combo with removable fan. For use with 2U/3U/4U/5U non-Intel chassis.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

QR

Quality/Reliability Hold.

RP

Retired Price:  All functions are blocked similar to RT status (orders, returns, shipments, etc).  However, RP status allows price reference structure maintenance and price record maintenance which will be reflected in Data Warehouse and Legacy systems.

RS

Reschedule

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

E2

Obsolete and past last time buy.

BR

Bookings Release (BR) – Product can be booked but not shipped.