Compare Intel® Products

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Essentials

Product Collection
Status
Vertical Segment
Launch Date
Bus Speed
Lithography
TDP
Supports Overclocking
Product Collection
Mobile Intel® CM246 Chipset Intel® C240 Series Chipsets Mobile Intel® HM370 Chipset Intel® 300 Series Mobile Chipsets Mobile Intel® QM370 Chipset Intel® 300 Series Mobile Chipsets
Status
Mobile Intel® CM246 Chipset Launched Mobile Intel® HM370 Chipset Launched Mobile Intel® QM370 Chipset Launched
Vertical Segment
Mobile Intel® CM246 Chipset Mobile Mobile Intel® HM370 Chipset Mobile Mobile Intel® QM370 Chipset Mobile
Launch Date
Mobile Intel® CM246 Chipset Q2'18 Mobile Intel® HM370 Chipset Q2'18 Mobile Intel® QM370 Chipset Q2'18
Bus Speed
Mobile Intel® CM246 Chipset 8 GT/s Mobile Intel® HM370 Chipset 8 GT/s Mobile Intel® QM370 Chipset 8 GT/s
Lithography
Mobile Intel® CM246 Chipset 14 nm Mobile Intel® HM370 Chipset 14 nm Mobile Intel® QM370 Chipset 14 nm
TDP
Mobile Intel® CM246 Chipset 3 W Mobile Intel® HM370 Chipset 3 W Mobile Intel® QM370 Chipset 3 W
Supports Overclocking
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes

Supplemental Information

Embedded Options Available
Datasheet
Embedded Options Available
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes
Datasheet
Mobile Intel® HM370 Chipset View now Mobile Intel® QM370 Chipset View now

Memory Specifications

# of DIMMs per channel
# of DIMMs per channel
Mobile Intel® CM246 Chipset 2 Mobile Intel® HM370 Chipset 2 Mobile Intel® QM370 Chipset 2

Processor Graphics

Intel® Clear Video Technology
# of Displays Supported
Intel® Clear Video Technology
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes
# of Displays Supported
Mobile Intel® CM246 Chipset 3 Mobile Intel® HM370 Chipset 3 Mobile Intel® QM370 Chipset 3

Expansion Options

PCI Support
PCI Express Revision
PCI Express Configurations
Max # of PCI Express Lanes
PCI Support
Mobile Intel® CM246 Chipset NO Mobile Intel® HM370 Chipset NO Mobile Intel® QM370 Chipset NO
PCI Express Revision
Mobile Intel® CM246 Chipset 3.0 Mobile Intel® HM370 Chipset 3.0 Mobile Intel® QM370 Chipset 3.0
PCI Express Configurations
Mobile Intel® CM246 Chipset x1, x2, x4 Mobile Intel® HM370 Chipset x1, x2, x4 Mobile Intel® QM370 Chipset x1, x2, x4
Max # of PCI Express Lanes
Mobile Intel® CM246 Chipset 24 Mobile Intel® HM370 Chipset 16 Mobile Intel® QM370 Chipset 20

I/O Specifications

# of USB Ports
USB Configuration
USB Revision
Max # of SATA 6.0 Gb/s Ports
RAID Configuration
Integrated LAN
Integrated Wireless
# of USB Ports
Mobile Intel® CM246 Chipset 14 Mobile Intel® HM370 Chipset 14 Mobile Intel® QM370 Chipset 14
USB Configuration
Mobile Intel® CM246 Chipset 10 Total USB 3.1 Ports
- Up to 6 USB 3.1 Gen 2 Ports
- Up to 10 USB 3.1 Gen 1 Ports
14 USB 2.0 Ports
Mobile Intel® HM370 Chipset 8 Total USB 3.1 Ports
- Up to 4 USB 3.1 Gen 2 Ports
- Up to 8 USB 3.1 Gen 1 Ports
14 USB 2.0 Ports
Mobile Intel® QM370 Chipset 10 Total USB 3.1 Ports
- Up to 6 USB 3.1 Gen 2 Ports
- Up to 10 USB 3.1 Gen 1 Ports
14 USB 2.0 Ports
USB Revision
Mobile Intel® CM246 Chipset 3.1/2.0 Mobile Intel® HM370 Chipset 3.1/2.0 Mobile Intel® QM370 Chipset 3.1/2.0
Max # of SATA 6.0 Gb/s Ports
Mobile Intel® CM246 Chipset 8 Mobile Intel® HM370 Chipset 4 Mobile Intel® QM370 Chipset 4
RAID Configuration
Mobile Intel® CM246 Chipset 0/1/5/10 Mobile Intel® HM370 Chipset 0/1/5/10 Mobile Intel® QM370 Chipset 0/1/5/10
Integrated LAN
Mobile Intel® CM246 Chipset Integrated MAC Mobile Intel® HM370 Chipset Integrated MAC Mobile Intel® QM370 Chipset Integrated MAC
Integrated Wireless
Mobile Intel® CM246 Chipset Intel® Wireless-AC MAC Mobile Intel® HM370 Chipset Intel® Wireless-AC MAC Mobile Intel® QM370 Chipset Intel® Wireless-AC MAC

Package Specifications

Package Size
Package Size
Mobile Intel® CM246 Chipset 25mm x 24mm Mobile Intel® HM370 Chipset 25mm x 24mm Mobile Intel® QM370 Chipset 25mm x 24mm

Advanced Technologies

Intel® Virtualization Technology for Directed I/O (VT-d)
Intel vPro® Platform Eligibility
Intel® ME Firmware Version
Intel® HD Audio Technology
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology enterprise
Intel® Stable IT Platform Program (SIPP)
Intel® Smart Sound Technology
Intel® Optane™ Memory Supported
Intel® Virtualization Technology for Directed I/O (VT-d)
Mobile Intel® CM246 Chipset Yes Mobile Intel® QM370 Chipset Yes
Intel vPro® Platform Eligibility
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset No Mobile Intel® QM370 Chipset Yes
Intel® ME Firmware Version
Mobile Intel® CM246 Chipset 12 Mobile Intel® HM370 Chipset 12 Mobile Intel® QM370 Chipset 12
Intel® HD Audio Technology
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes
Intel® Rapid Storage Technology
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes
Intel® Rapid Storage Technology enterprise
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset No Mobile Intel® QM370 Chipset Yes
Intel® Stable IT Platform Program (SIPP)
Mobile Intel® CM246 Chipset Yes Mobile Intel® QM370 Chipset Yes
Intel® Smart Sound Technology
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset Yes Mobile Intel® QM370 Chipset Yes
Intel® Optane™ Memory Supported
Mobile Intel® HM370 Chipset Yes

Security & Reliability

Intel® Trusted Execution Technology
Intel® Trusted Execution Technology
Mobile Intel® CM246 Chipset Yes Mobile Intel® HM370 Chipset No Mobile Intel® QM370 Chipset Yes

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

QR

Quality/Reliability Hold.

RP

Retired Price:  All functions are blocked similar to RT status (orders, returns, shipments, etc).  However, RP status allows price reference structure maintenance and price record maintenance which will be reflected in Data Warehouse and Legacy systems.

RS

Reschedule

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

E2

Obsolete and past last time buy.

BR

Bookings Release (BR) – Product can be booked but not shipped.