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Essentials

Product Collection
Status
Launch Date
Bus Speed
Lithography
TDP
Supports Overclocking
Product Collection
Mobile Intel® HM370 Chipset Intel® 300 Series Chipsets
Status
Mobile Intel® HM370 Chipset Launched
Launch Date
Mobile Intel® HM370 Chipset Q2'18
Bus Speed
Mobile Intel® HM370 Chipset 8 GT/s DMI3
Lithography
Mobile Intel® HM370 Chipset 14 nm
TDP
Mobile Intel® HM370 Chipset 3 W
Supports Overclocking
Mobile Intel® HM370 Chipset Yes

Supplemental Information

Embedded Options Available
Embedded Options Available
Mobile Intel® HM370 Chipset Yes

Memory Specifications

# of DIMMs per channel
# of DIMMs per channel
Mobile Intel® HM370 Chipset 2

Processor Graphics

Intel® Clear Video Technology
# of Displays Supported
Intel® Clear Video Technology
Mobile Intel® HM370 Chipset Yes
# of Displays Supported
Mobile Intel® HM370 Chipset 3

Expansion Options

PCI Support
PCI Express Revision
PCI Express Configurations
Max # of PCI Express Lanes
PCI Support
Mobile Intel® HM370 Chipset NO
PCI Express Revision
Mobile Intel® HM370 Chipset 3.0
PCI Express Configurations
Mobile Intel® HM370 Chipset x1, x2, x4
Max # of PCI Express Lanes
Mobile Intel® HM370 Chipset 16

I/O Specifications

# of USB Ports
USB Configuration
USB Revision
Max # of SATA 6.0 Gb/s Ports
RAID Configuration
Integrated LAN
Integrated Wireless
# of USB Ports
Mobile Intel® HM370 Chipset 14
USB Configuration
Mobile Intel® HM370 Chipset 8 Total USB 3.1 Ports
- Up to 4 USB 3.1 Gen 2 Ports
- Up to 8 USB 3.1 Gen 1 Ports
14 USB 2.0 Ports
USB Revision
Mobile Intel® HM370 Chipset 3.1/2.0
Max # of SATA 6.0 Gb/s Ports
Mobile Intel® HM370 Chipset 4
RAID Configuration
Mobile Intel® HM370 Chipset 0/1/5/10
Integrated LAN
Mobile Intel® HM370 Chipset Integrated MAC
Integrated Wireless
Mobile Intel® HM370 Chipset Intel® Wireless-AC MAC

Package Specifications

Package Size
Low Halogen Options Available
Package Size
Mobile Intel® HM370 Chipset 25mm x 24mm
Low Halogen Options Available
Mobile Intel® HM370 Chipset No

Advanced Technologies

Intel® Optane™ Memory Supported
Intel® vPro™ Platform Eligibility
Intel® ME Firmware Version
Intel® HD Audio Technology
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology enterprise
Intel® Smart Sound Technology
Intel® Optane™ Memory Supported
Mobile Intel® HM370 Chipset Yes
Intel® vPro™ Platform Eligibility
Mobile Intel® HM370 Chipset No
Intel® ME Firmware Version
Mobile Intel® HM370 Chipset 12
Intel® HD Audio Technology
Mobile Intel® HM370 Chipset Yes
Intel® Rapid Storage Technology
Mobile Intel® HM370 Chipset Yes
Intel® Rapid Storage Technology enterprise
Mobile Intel® HM370 Chipset No
Intel® Smart Sound Technology
Mobile Intel® HM370 Chipset Yes

Security & Reliability

Intel® Trusted Execution Technology
Intel® Trusted Execution Technology
Mobile Intel® HM370 Chipset No

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

QR

Quality/Reliability Hold.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RS

Reschedule

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

E2

Obsolete and past last time buy.

BR

Bookings Release (BR) – Product can be booked but not shipped.