Produkte mit früherer Bezeichnung Walker Pass

Produktbezeichnung Einführungsdatum Status Mainboard-Format Gehäusetyp Sockel Vergleich
Alle | Keine
Rechenmodul für Intel® Serversystem S9256WK1HLC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9248WK1HLC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9248WK2HLC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9232WK2HLC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9248WK2HAC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9232WK2HAC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9232WK1HLC Q3'19 Launched 8.33” x 21.5” 2U Rack front IO
Intel® Server System LWK2AC3PXXX01 Q2'19 Discontinued 8.33” x 21.5” 2U Rack front IO
Intel® Server System LWK2LC3U4880A Q2'19 Discontinued 8.33” x 21.5” 2U Rack front IO
Intel® Server System LWK2LC3U5680A Q2'19 Launched 8.33” x 21.5” 2U Rack front IO
Rechenmodul für Intel® Serversystem S9232WK1HAC Q1'20 Launched 8.33” x 21.5” 2U Rack front IO
I/O Breakout cable spare kit AXXCONNTDBG Q3'19 Launched
Liquid-Cooling Loop Kit FXXWKLCLP Q3'19 Launched
2U Passive Heat Sink FXXWKHS Q3'19 Launched
M.2 Heat sink Assembly FXXWKM2HS Q3'19 Launched
Liquid-Cooling Memory Retention Clip FXXWKLCDMCLP Q3'19 Launched
Liquid-Cooling Loop DIMM TIMM FXXWKLCDMTM Q3'19 Launched
1U Air-Cooled Rear Heat Sink FXXWK1UHSB Q1'20 Launched
1U Air-Cooled front Heat Sink FXXWK1UHSF Q1'20 Launched
1U Spare PCIe Riser
(x16 PCIe slot and M.2 Connector) FXXWK1URISER
Q3'19 Launched
2U Spare PCIe Riser
(Two x16 PCIe slots, M.2 Connector and U.2 Adapter Card Connector) FXXWK2URISER
Q3'19 Launched

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