Intel® Compute Module HNS2600TP24R
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|Additional Extended Warranty Details||Intel® Compute Module HNS2000 Extended Warranty|
|# of QPI Links||2|
|Compatible Product Series||Intel® Xeon® Processor E5-2600 v4 Family|
|Board Form Factor||Custom 6.8" x 18.9"|
|Chassis Form Factor||Rack|
|Integrated Systems Available||No|
|Integrated BMC with IPMI||IPMI 2.0|
|Embedded Options Available||No|
|Included Items||Integrated compute module includes: (1) Intel® Server Board S2600TPR w/two 1Gb ports (Intel® Ethernet Controller I350); (1) 12Gb/s bridge board (FHWKPTPBGB24); (1) node power board (FH2000NPB2); (1) one slot PCIe x16 riser card (FHW1U16RISER2); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) front 1U passive heat sinks (FXXEA84X106HS); (1) rear 1U passive heat sink (FXXCA91X91HS); (3) 4056 dual rotor fan (FXX4056DRFAN2); (1) Dual RJ-45 port 10GBASE-T I/O module (AXX10GBTWLHW3); (1) PCI Express* x16 rIOM riser and rIOM carrier board kit (AXXKPTPM2IOM); (1) airduct; (1) 1U node tray|
|Recommended Customer Price||N/A|
|Board Chipset||(Intel® DH82029 PCH)|
|Description||A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600TPR for higher memory capability and flexible configuration options for the Intel® Server Chassis H2224XXKR2/H2224XXLR2.|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||1.02 TB|
|Max # of Memory Channels||8|
|Max Memory Bandwidth||115 GB/s|
|Physical Address Extensions||46-bit|
|Max # of DIMMs||16|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||Yes|
|PCI Express Revision||3.0|
|Max # of PCI Express Lanes||64|
|PCIe x16 Gen 3||1|
|Connector for Intel® I/O Expansion Module x8 Gen 3||1|
|Riser Slot 1: Total # of Lanes||16|
|Riser Slot 2: Total # of Lanes||16|
|Riser Slot 3: Total # of Lanes||24|
|Riser Slot 4: Total # of Lanes||16|
|# of USB Ports||4|
|Total # of SATA Ports||6|
|# of Serial Ports||1|
|# of LAN Ports||4|
|Integrated LAN||2x 1GbE + 2x 10GbE RJ45|
|Embedded USB (eUSB) Solid State Drive Option||No|
|Integrated SAS Ports||6|
|Max CPU Configuration||2|
|Low Halogen Options Available||See MDDS|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||Yes|
|Intel® Remote Management Module Support||Yes|
|Intel® Node Manager||Yes|
|Intel® Quick Resume Technology||Yes|
|Intel® Quiet System Technology||Yes|
|Intel® Fast Memory Access||Yes|
|Intel® Flex Memory Access||Yes|
|Intel® I/O Acceleration Technology||Yes|
|Intel® Advanced Management Technology||Yes|
|Intel® Server Customization Technology||Yes|
|Intel® Build Assurance Technology||Yes|
|Intel® Efficient Power Technology||Yes|
|Intel® Quiet Thermal Technology||Yes|
-Intel® Platform Protection Technology
|Trusted Execution Technology ‡||No|
-Riser Card Options
-Spares and Accessories
-Network Interface Card
Ordering and Spec Information
Trade Compliance Information
Ordering and Spec Information
|Spec Code||Ordering Code||Step||RCP|
|Intel® Compute Module HNS2600TP24R, Single|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.