Intel® Server Board S1200SPL
|EOL Announce||Tuesday, November 15, 2016|
|Last Order||Monday, January 23, 2017|
|Last Receipt Attributes||Monday, March 13, 2017|
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|Additional Extended Warranty Details||Single Processor Board Extended Warranty|
|# of QPI Links||0|
|Compatible Product Series||Intel® Xeon® Processor E3-1200 v5 Family|
|Board Form Factor||uATX|
|Chassis Form Factor||Pedestal|
|Integrated Systems Available||No|
|Integrated BMC with IPMI||IPMI 2.0|
|Embedded Options Available||No|
|Included Items||(1) Server Board; (4) SATA Data Cables; (1) I/O Shield; (1) Attention Document; (1) Quick Start User’s Guide; (1) Quick Configuration Label|
|Recommended Customer Price||N/A|
|Board Chipset||Intel® C236 Chipset|
|Description||An entry-level single socket board with Intel® C236 chipset supporting one Intel® Xeon® Processor E3-1200 v5 family, 4 UDIMMs, Dual integrated 1GBaseT Ethernet. Supports eight SATA3 ports, M.2 SATA SSD (42mm) and Intel® Integrated RAID Module.|
|Target Market||Small and Medium Business|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||64 GB|
|Memory Types||DDR4 ECC UDIMM|
|Max # of Memory Channels||2|
|Max Memory Bandwidth||68.256 GB/s|
|Physical Address Extensions||40-bit|
|Max # of DIMMs||4|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||Yes|
|Graphics Output||Display Port, VGA|
|PCI Express Revision||3.0|
|Max # of PCI Express Lanes||20|
|PCIe x4 Gen 3||1|
|PCIe x8 Gen 3||1|
|PCIe x16 Gen 3||1|
|Connector for Intel® I/O Expansion Module x8 Gen 3||1|
|Connector for Intel® Integrated RAID Module||1|
|USB Revision||2.0 & 3.0|
|# of USB Ports||9|
|Total # of SATA Ports||8|
|RAID Configuration||Software RAID RST (0,1,10,5) and ESRT2 (0,1,10)|
|# of Serial Ports||1|
|# of LAN Ports||2|
|Integrated LAN||2x 1GbE|
|Embedded USB (eUSB) Solid State Drive Option||No|
|Max CPU Configuration||1|
|Low Halogen Options Available||See MDDS|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||Yes|
|Intel® Remote Management Module Support||Yes|
|Intel® Node Manager||Yes|
|Intel® Rapid Storage Technology enterprise||Yes|
|Intel® I/O Acceleration Technology||Yes|
-Intel® Platform Protection Technology
|Trusted Execution Technology ‡||Yes|
-Intel® Transparent Supply Chain
Ordering and Spec Information
Trade Compliance Information
Ordering and Spec Information
|Spec Code||Ordering Code||Step||RCP|
|Intel® Server Board S1200SPL, Disti 5 Pack|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.