Intel® Compute Module HNS7200AP

Specifications

Supplemental Information

  • Embedded Options Available No
  • Description Intel® Server S7200AP Product Family provides parallelized workflows in the HPC market, featuring features support for Intel® Xeon® Phi™ processors, with 6 DIMMs (1DPC) and optional support for Intel® Omni Path® Fabric Technology.
  • Additional Information URL View now

Memory Specifications

Graphics Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 1
  • Low Halogen Options Available See MDDS

Intel® Data Protection Technology

Intel® Platform Protection Technology

Intel® Transparent Supply Chain

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Compatible Products

Processors

Product Name Status Max Turbo Frequency Processor Base Frequency Cache # of Cores Recommended Customer Price Compare
All | None
Intel® Xeon Phi™ Processor 7210 Launched 1.50 GHz 1.30 GHz 32 MB L2 64 $2438.00
Intel® Xeon Phi™ Processor 7210F Launched 1.50 GHz 1.30 GHz 32 MB L2 64 $2585.00
Intel® Xeon Phi™ Processor 7230 Launched 1.50 GHz 1.30 GHz 32 MB L2 64 $3710.00
Intel® Xeon Phi™ Processor 7230F Launched 1.50 GHz 1.30 GHz 32 MB L2 64 $3857.00
Intel® Xeon Phi™ Processor 7250 Launched 1.60 GHz 1.40 GHz 34 MB L2 68 $4876.00
Intel® Xeon Phi™ Processor 7250F Launched 1.60 GHz 1.40 GHz 34 MB L2 68 $5023.00

Chassis

Product Name Status Chassis Form Factor Compare
All | None
Intel® Server Chassis H2216XXLR2 Launched 2U Rack
Intel® Server Chassis H2312XXLR2 Launched 2U Rack

RAID

Product Name Status Board Form Factor RAID Level Supported # of Ports Internal # of Ports External Embedded Memory Compare
All | None
Intel® RAID Controller RS3MC044 Launched Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 4 4 1GB
Intel® RAID Controller RS3SC008 Launched Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 8 1GB

Network Interface Card

Product Name Status Cabling Type TDP Recommended Customer Price # of Ports System Interface Type Compare
All | None
Intel® Ethernet Converged Network Adapter X710-DA2 Launched SFP+ Direct Attached Twinaxial Cabling up to 10m $296.00 - $299.00 Dual PCIe v3.0 (8.0 GT/s)
Intel® Ethernet Converged Network Adapter X550-T2 Launched RJ-45 Category-6 up to 55m; Category-6A up to 100m $341.00 - $354.00 Dual PCIe v3.0 (8.0GT/s)
Intel® Ethernet Converged Network Adapter X550-T1 Launched RJ-45 Category-6 up to 55m; Category-6A up to 100m $290.00 - $301.00 Single PCIe v3.0 (8.0 GT/s)
Intel® Ethernet Converged Network Adapter X540-T1 Launched RJ-45 Category-6 up to 55m; Category-6A up to 100m $341.00 Single PCIe 2.1 (5.0 GT/s)
Intel® Ethernet Converged Network Adapter X540-T2 Launched RJ-45 Category-6 up to 55 m; Category-6A up to 100 m 13.4 W $508.00 - $513.00 Dual PCIe v2.1 (5.0GT/s)
Intel® Ethernet Converged Network Adapter X520-QDA1 Launched QSFP+ Direct Attach Twin Axial Cabling up to 10m 20 W $532.00 Single PCIe v3.0 (8.0 GT/s)

Fabric Products

Product Name Status # of Ports External Data Rate Per Port Compare
All | None
Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x8 Launched 1 58Gbps
Intel® Omni-Path Host Fabric Interface Adapter 100 Series 1 Port PCIe x16 Launched 1 100Gbps

SSD

Product Name Capacity Status Form Factor Interface Compare
All | None
Intel® SSD DC S3710 Series
(1.2TB, 2.5in SATA 6Gb/s, 20nm, MLC)
1.2 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3710 Series
(800GB, 2.5in SATA 6Gb/s, 20nm, MLC)
800 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3710 Series
(400GB, 2.5in SATA 6Gb/s, 20nm, MLC)
400 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3710 Series
(200GB, 2.5in SATA 6Gb/s, 20nm, MLC)
200 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(1.6TB, 2.5in SATA 6Gb/s, 20nm, MLC)
1.6 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(1.2TB, 2.5in SATA 6Gb/s, 20nm, MLC)
1.2 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(800GB, 2.5in SATA 6Gb/s, 20nm, MLC)
800 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(480GB, 2.5in SATA 6Gb/s, 20nm, MLC)
480 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(400GB, 2.5in SATA 6Gb/s, 20nm, MLC)
400 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(200GB, 2.5in SATA 6Gb/s, 20nm, MLC)
200 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3610 Series
(100GB, 2.5in SATA 6Gb/s, 20nm, MLC)
100 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(1.6TB, 2.5in SATA 6Gb/s, 3D1, MLC)
1.6 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(1.2TB, 2.5in SATA 6Gb/s, 3D1, MLC)
1.2 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(960GB, 2.5in SATA 6Gb/s, 3D1, MLC)
960 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(800GB, 2.5in SATA 6Gb/s, 3D1, MLC)
800 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(480GB, 2.5in SATA 6Gb/s, 3D1, MLC)
480 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(240GB, 2.5in SATA 6Gb/s, 3D1, MLC)
240 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3520 Series
(150GB, 2.5in SATA 6Gb/s, 3D1, MLC)
150 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(1.6TB, 2.5in SATA 6Gb/s, 16nm, MLC)
1.6 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(1.2TB, 2.5in SATA 6Gb/s, 16nm, MLC)
1.2 TB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(800GB, 2.5in SATA 6Gb/s, 16nm, MLC)
800 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(240GB, 2.5in SATA 6Gb/s, 16nm, MLC)
240 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(120GB, 2.5in SATA 6Gb/s, 16nm, MLC)
120 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC S3510 Series
(80GB, 2.5in SATA 6Gb/s, 16nm, MLC)
80 GB Launched 2.5" 7mm SATA 3.0 6Gb/S
Intel® SSD DC P3700 Series
(2.0TB, 1/2 Height PCIe 3.0, 20nm, MLC)
2 TB Launched HHHL (CEM2.0) PCIe NVMe 3.0 x4
Intel® SSD DC P3700 Series
(1.6TB, 1/2 Height PCIe 3.0, 20nm, MLC)
1.6 TB Launched HHHL (CEM2.0) PCIe NVMe 3.0 x4
Intel® SSD DC P3700 Series
(800GB, 1/2 Height PCIe 3.0, 20nm, MLC)
800 GB Launched HHHL (CEM2.0) PCIe NVMe 3.0 x4
Intel® SSD DC P3700 Series
(400GB, 1/2 Height PCIe 3.0, 20nm, MLC)
400 GB Launched HHHL (CEM2.0) PCIe NVMe 3.0 x4

Ordering and Compliance

Ordering and spec information

  • Intel® Compute Module HNS7200AP, Single

  • Ordering Code HNS7200AP

Trade compliance information

  • ECCN5A992CN3
  • CCATSG074226+
  • US HTS8473305100

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.

Refer to Datasheet for formal definitions of product properties and features.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s)

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated LAN

Integrated LAN indicates presence of the LAN ports built into the system board.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Quick Resume Technology

Intel® Quick Resume Technology Driver (QRTD) allows the Intel® Viiv™ technology-based PC to behave like a consumer electronic device with instant on/off (after initial boot, when activated) capability.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization techology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

QR

Quality/Reliability Hold.

RS

Reschedule

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