Intel Atom® x3-C3230RK Processor

1M Cache, up to 1.10 GHz

Specifications

CPU Specifications

Supplemental Information

Memory Specifications

GPU Specifications

I/O Specifications

  • # of USB Ports 1
  • USB Revision 2.0 OTG
  • General Purpose IO 4 x I2C
  • UART 2 x USIF configurable

Networking Specifications

Package Specifications

  • Operating Temperature Range -25°C to 85°C
  • Operating Temperature (Maximum) 85 °C
  • Operating Temperature (Minimum) -25 °C
  • Package Size 11mm x 11mm

Advanced Technologies

Drivers and Software

Latest Drivers & Software

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Name

Intel Atom® Processor C3200 Series for Yocto Project*: Release Notes and Software Package

Support

Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Burst Frequency

Burst frequency is the maximum single core frequency at which the processor is capable of operating. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Scenario Design Power (SDP)

Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.

Launch Date

The date the product was first introduced.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Max Refresh Rate

Max Refresh Rate indicates the frequency with which a monitor's display is updated.

Max Resolution (eDP - Integrated Flat Panel)‡

Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.

OpenGL* Support

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Baseband Functions

Baseband functions refers to the mobile telephony protocols supported by the baseband processor.

RF Transceiver

An RF transceiver is a chip that transmits and receives a high frequency radio signal.

RF Transceiver Functions

RF transceiver functions refers to the mobile telephony protocols supported by the RF transceiver.

Protocol Stack

Protocol stack is the software implementation of a networking protocol suite that defines the communication between each layer of the network

Secure Boot

Secure Boot ensures that only trusted software with a known configuration executes as part of the boot process. It enables the hardware root of trust which starts the authentication chain for platform firmware and subsequent software load, like the operating system, for example.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.