Intel® Ethernet Converged Network Adapter XL710-QDA2

Specifications

Networking Specifications

  • # of Ports Dual
  • System Interface Type PCIe v3.0 (8.0 GT/s)
  • Intel® Virtualization Technology for Connectivity (VT-c) Yes
  • Speed & Slot Width 8.0 GT/s, x 8 Lane
  • Controller Intel XL710

Package Specifications

  • Low Halogen Options Available See MDDS

Intel® Virtualization Technology for Connectivity

Advanced Technologies

Compatible Products

Server/Workstation Board

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP Compare
All | None
Intel® Server Board S2600CW2R Launched SSI EEB 12" x 13" Rack or Pedestal Socket R3 No 145 W
Intel® Server Board S2600CW2SR Launched SSI EEB 12" x 13" Rack or Pedestal Socket R3 No 145 W
Intel® Server Board S2600CWTR Launched SSI EEB 12" x 13" Rack or Pedestal Socket R3 No 145 W
Intel® Server Board S2600CWTSR Launched SSI EEB 12" x 13" Rack or Pedestal Socket R3 No 145 W
Intel® Server Board S2600KPR Launched Custom 6.4" x 17.7" Rack Socket R3 No 160 W
Intel® Server Board S2600KPFR Launched Custom 6.4" x 17.7" Rack Socket R3 No 160 W
Intel® Server Board S2600KPTR Launched Custom 6.4" x 17.7" Rack Socket R3 No 160 W
Intel® Server Board S2600TPR Launched Custom 6.8" x 18.9" Rack Socket R3 No 160 W
Intel® Server Board S2600TPFR Launched Custom 6.8" x 18.9" Rack Socket R3 No 160 W
Intel® Server Board S2600WTTR Launched Custom 16.7" x 17" Rack Socket R3 No 145 W
Intel® Server Board S2600WT2R Launched Custom 16.7" x 17" Rack Socket R3 No 145 W
Intel® Server Board S2600WTTS1R Launched Custom 16.7" x 17" Rack Socket R3 No 145 W
Intel® Compute Module HNS2600KPFR Launched Custom 6.4" x 17.7" Rack Socket R3 No 145 W
Intel® Compute Module HNS2600KPR Launched Custom 6.4" x 17.7" Rack Socket R3 No 145 W
Intel® Compute Module HNS2600TP24R Launched Custom 6.8" x 18.9" Rack Socket R3 No 145 W
Intel® Compute Module HNS2600TP24SR Launched Custom 6.8" x 18.9" Rack Socket R3 No 145 W
Intel® Compute Module HNS2600TP24STR Launched Custom 6.8" x 18.9" Rack Socket R3 Yes 145 W
Intel® Compute Module HNS2600TPR Launched Custom 6.8" x 18.9" Rack Socket R3 No 145 W

System

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System R1208WT2GSR Launched 1U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R1208WTTGSR Launched 1U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R1304WT2GSR Launched 1U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R1304WTTGSR Launched 1U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2208WTTYSR Launched 2U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2208WT2YSR Launched 2U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2208WTTYC1R Launched 2U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2308WTTYSR Launched 2U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2312WTTYSR Launched 2U Rack Custom 16.7" x 17" Socket R3
Intel® Server System R2224WTTYSR Launched 2U Rack Custom 16.7" x 17" Socket R3

Ordering and Compliance

Ordering and spec information

  • Intel® Ethernet Converged Network Adapter XL710-QDA2, OEM Gen

  • Ordering Code EXL710QDA2G1P5
  • Intel® Ethernet Converged Network Adapter XL710-QDA2, OEM Gen

  • Ordering Code XL710QDA2G2P5
  • Intel® Ethernet Converged Network Adapter XL710-QDA2, retail bulk

  • Ordering Code XL710QDA2BLK
  • RCP $459.00
  • Intel® Ethernet Converged Network Adapter XL710-QDA2, retail unit

  • Ordering Code XL710QDA2
  • RCP $476.00

Retired and discontinued

  • Intel® Ethernet Converged Network Adapter XL710-QDA2, OEM Gen

  • Ordering Code XL710QDA2G1P5

Trade compliance information

  • ECCN5A991
  • CCATSNA
  • US HTS8517620050-NIC

PCN/MDDS Information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.

Refer to Datasheet for formal definitions of product properties and features.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Launch Date

The date the product was first introduced.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

Conflict Free

“Conflict free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.

Flexible Port Partitioning

Flexible Port Partitioning (FPP) technology utilizes industry standard PCI SIG SR-IOV to efficiently divide your physical Ethernet device into multiple virtual devices, providing Quality of Service by ensuring each process is assigned to a Virtual Function and is provided a fair share of the bandwidth.

Virtual Machine Device Queues (VMDq)

Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance

PCI-SIG* SR-IOV Capable

Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.

iWARP/RDMA

iWARP delivers converged, low-latency fabric services to data centers through Remote Direct Memory Access (RDMA) over Ethernet. The key iWARP components that deliver low-latency are Kernel Bypass, Direct Data Placement, and Transport Acceleration.

Intel® Data Direct I/O Technology

Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

QR

Quality/Reliability Hold.

RS

Reschedule

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