Intel® Celeron® Processor G1840T
(2M Cache, 2.50 GHz)
|# of Cores||2|
|# of Threads||2|
|Clock Speed||2.5 GHz|
|Instruction Set Extensions||SSE4.1/4.2|
|Embedded Options Available||No|
|Max TDP||35 W|
|Thermal Solution Specification||PCG 2013A|
|Recommended Customer Price||TRAY: $42.00|
|Max Memory Size (dependent on memory type)||32 GB|
|# of Memory Channels||2|
|Max Memory Bandwidth||21.3 GB/s|
|ECC Memory Supported ‡||Yes|
|Processor Graphics ‡||Intel® HD Graphics|
|Graphics Base Frequency||200 MHz|
|Graphics Max Dynamic Frequency||1.05 GHz|
|Graphics Video Max Memory||1.7 GB|
|Intel® Quick Sync Video||Yes|
|Intel® Wireless Display||Yes|
|Intel® Clear Video HD Technology||Yes|
|# of Displays Supported ‡||3|
|PCI Express Revision||3.0|
|PCI Express Configurations ‡||Up to 1x16, 2x8, 1x8/2x4|
|Max # of PCI Express Lanes||16|
|Max CPU Configuration||1|
|Package Size||37.5mm x 37.5mm|
|Graphics and IMC Lithography||22 nm|
|Low Halogen Options Available||See MDDS|
|Intel® Turbo Boost Technology ‡||No|
|Intel® vPro Technology ‡||No|
|Intel® Hyper-Threading Technology ‡||No|
|Intel® Virtualization Technology (VT-x) ‡||Yes|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||No|
|Intel® VT-x with Extended Page Tables (EPT) ‡||Yes|
|Intel® 64 ‡||Yes|
|Enhanced Intel SpeedStep® Technology||Yes|
|Thermal Monitoring Technologies||Yes|
|Intel® Virtualization Technology for Itanium (VT-i)||No|
|Intel® Stable Image Platform Program (SIPP)||No|
Ordering and Spec Information
Trade Compliance Information
Ordering and Spec Information
|Spec Code||Ordering Code||Step||RCP|
|Intel® Celeron® Processor G1840T (2M Cache, 2.50 GHz) FC-LGA12C, Tray|
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.
For benchmarking data see http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.