Intel® Galileo Board
|# of QPI Links||0|
|Board Form Factor||Arduino|
|Socket||Quark 393pin FCPGA|
|Extended Life Program (XLP)||No|
|Embedded Options Available||No|
|DC Input Voltage Supported||5|
|Recommended Customer Price||N/A|
|Description||Arduino Compatible development board|
|Processor Included||Intel® Quark™ SoC X1000 (16K Cache, 400 MHz)|
|Warranty Period||1 yrs|
|Max Memory Size (dependent on memory type)||256 MB|
|# of Memory Channels||1|
|Max Memory Bandwidth||2.5 GB/s|
|Physical Address Extensions||32-bit|
|# of DIMMs||0|
|ECC Memory Supported ‡||No|
|PCI Support||PCI Express|
|PCI Express Revision||2.0|
|PCI Express Configurations ‡||x1|
|Max # of PCI Express Lanes||1|
|PCIe x1 Gen 2.x||1|
|PCIe Mini Card Slot (Full Length)||1|
|# of USB Ports||3|
|USB 2.0 Configuration (Back + Internal)||3|
|USB 3.0 Configuration (Back + Internal)||0|
|# of Serial Ports||1|
|Max CPU Configuration||1|
|Package Size||15mm x 15mm|
|Low Halogen Options Available||See MDDS|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||No|
|Intel® vPro Technology ‡||No|
|Intel® Remote Wake Technology||No|
|Intel® Remote PC Assist Technology||No|
|Intel® CIRA Technology||No|
|Intel® Quick Resume Technology||No|
|Intel® Quiet System Technology||No|
|Intel® HD Audio Technology||No|
|Intel® AC97 Technology||No|
|Intel® Matrix Storage Technology||No|
|Intel® Rapid Storage Technology||No|
|Intel® Fast Memory Access||No|
|Intel® Flex Memory Access||No|
|Intel® Virtualization Technology (VT-x) ‡||No|
|Intel® Small Business Advantage||No|
-Intel® Data Protection Technology
|AES New Instructions||No|
-Intel® Platform Protection Technology
|Trusted Execution Technology ‡||No|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.