Intel® Core™ i5-4360U Processor
(3M Cache, up to 3.00 GHz)
|# of Cores||2|
|# of Threads||4|
|Clock Speed||1.5 GHz|
|Max Turbo Frequency||3 GHz|
|Intel® Smart Cache||3 MB|
|Instruction Set Extensions||SSE 4.1/4.2, AVX 2.0|
|Embedded Options Available||No|
|Max TDP||15 W|
|Recommended Customer Price||N/A|
|Max Memory Size (dependent on memory type)||16 GB|
|Memory Types||DDR3L-1333/1600; LPDDR3-1333/1600|
|# of Memory Channels||2|
|Max Memory Bandwidth||25.6 GB/s|
|ECC Memory Supported ‡||No|
|Processor Graphics ‡||Intel® HD Graphics 5000|
|Graphics Base Frequency||200 MHz|
|Graphics Max Dynamic Frequency||1.1 GHz|
|Intel® Quick Sync Video||Yes|
|Intel® InTru™ 3D Technology||Yes|
|Intel® Flexible Display Interface (Intel® FDI)||No|
|Intel® Clear Video HD Technology||Yes|
|Intel® Wireless Display||Yes|
|# of Displays Supported ‡||3|
|PCI Express Revision||2.0|
|PCI Express Configurations ‡||4x1, 2x4|
|Max # of PCI Express Lanes||12|
|# of USB Ports||4|
|Total # of SATA Ports||4|
|General Purpose IO||Yes|
|Max # of SATA 6.0 Gb/s Ports||4|
|Max CPU Configuration||1|
|Package Size||40mm x 24mm x 1.5mm|
|Low Halogen Options Available||See MDDS|
|Intel® Turbo Boost Technology ‡||2.0|
|Intel® vPro Technology ‡||Yes|
|Intel® Hyper-Threading Technology ‡||Yes|
|Intel® Virtualization Technology (VT-x) ‡||Yes|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||Yes|
|Intel® VT-x with Extended Page Tables (EPT) ‡||Yes|
|Intel® 64 ‡||Yes|
|Enhanced Intel SpeedStep® Technology||Yes|
|Thermal Monitoring Technologies||Yes|
|Intel® ME Firmware Version||9.5|
|Intel® HD Audio Technology||Yes|
|Intel® Matrix Storage Technology||No|
|Intel® Identity Protection Technology ‡||Yes|
|Intel® Rapid Storage Technology||Yes|
|Intel® Smart Connect Technology||Yes|
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.