Intel® Server Board S2400LP
|Status||End of Life|
|EOL Announce||Thursday, January 10, 2013|
|Last Order||Thursday, January 10, 2013|
|Last Receipt Attributes||Sunday, November 10, 2013|
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|# of QPI Links||1|
|Compatible Product Series||Intel® Xeon® Processor E5-2400 Product Family & Intel® Xeon® Processor E5-2400 v2 Product Family|
|Board Form Factor||Custom 6.8'' x 16.6''|
|Chassis Form Factor||2U Rack|
|Integrated Systems Available||Yes|
|Integrated BMC with IPMI||IPMI 2.0|
|Embedded Options Available||No|
|Included Items||(1) Intel® Server Board S2400LP.|
|Recommended Customer Price||N/A|
|Board Chipset||Intel® C602 Chipset (Intel® BD82C602 PCH)|
|Description||A high density server board supporting two Intel® Xeon® Processors E5-2400 family and 12 DIMMs for best cost efficiency; the ideal option for High Performance Computing and Datacenter deployment.|
|Target Market||High Performance Computing, Cloud/Datacenter|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||384 GB|
|Memory Types||DDR3 ECC UDIMM 1333, 1600/ RDIMM 1066,1333,1600,1866/ LRDIMM 1333, 1600, 1866|
|Max # of Memory Channels||6|
|Max Memory Bandwidth||614.4 GB/s|
|Physical Address Extensions||46-bit|
|Max # of DIMMs||12|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||Yes|
|PCI Express Revision||3.0|
|Max # of PCI Express Lanes||24|
|PCIe x8 Gen 3||1|
|PCIe x16 Gen 3||1|
|Connector for Intel® I/O Expansion Module||1|
|# of USB Ports||4|
|Total # of SATA Ports||5|
|RAID Configuration||Software RAID ESRT2 (0,1,5,10) and RSTe (0,1,5,10)|
|# of Serial Ports||1|
|# of LAN Ports||2|
|Integrated LAN||2x 1GbE|
|Embedded USB (eUSB) Solid State Drive Option||No|
|Integrated SAS Ports||0|
|Max CPU Configuration||2|
|Low Halogen Options Available||See MDDS|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||No|
|Intel® Remote Management Module Support||Yes|
|Intel® Node Manager||Yes|
|Intel® Quick Resume Technology||No|
|Intel® Quiet System Technology||Yes|
|Intel® HD Audio Technology||No|
|Intel® Matrix Storage Technology||No|
|Intel® Rapid Storage Technology||No|
|Intel® Rapid Storage Technology enterprise||Yes|
|Intel® Fast Memory Access||Yes|
|Intel® Flex Memory Access||Yes|
|Intel® I/O Acceleration Technology||Yes|
|Intel® Advanced Management Technology||Yes|
|Intel® Server Customization Technology||Yes|
|Intel® Build Assurance Technology||Yes|
|Intel® Efficient Power Technology||Yes|
|Intel® Quiet Thermal Technology||Yes|
-Intel® Data Protection Technology
|AES New Instructions||Yes|
-Intel® Platform Protection Technology
|Trusted Execution Technology ‡||Yes|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.