Spare 750W Hot-Swap Power Supply FXX750GERPS

1U Form Factor, Gold-Efficiency

Specifications

  • Product Collection Spare Power Options
  • Status End of Life
  • Launch Date Q1'12
  • Expected Discontinuance Q4'16
  • EOL Announce Thursday, December 15, 2016
  • Last Order Wednesday, March 1, 2017
  • Last Receipt Attributes Thursday, June 1, 2017
  • Included Items (1) Spare 750W redundant power supply FXX750GERPS (1U Form Factor, Gold-Efficiency) supporting Intel® Server Board S2600IP in R2000 chassis
  • Recommended Customer Price N/A

Supplemental Information

  • Description 750W Hot-Swap Enterprise Redundant Power Supply FXX750GERPS, 1U Form Factor, Gold-Efficiency, supporting Intel® Server Board S2600IP in R2000 chassis
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Compatible Products

System

Product Name Status Chassis Form Factor Board Form Factor Socket Compare
All | None
Intel® Server System R2216IP4LHPC End of Life 2U Rack Custom 14.2" x 15" Socket R
Intel® Server System R2224IP4LHPC End of Life 2U Rack Custom 14.2" x 15" Socket R
Intel® Server System R2208IP4LHPC End of Life 2U Rack Custom 14.2" x 15" Socket R
Intel® Server System R2308IP4LHPC End of Life 2U Rack Custom 14.2" x 15" Socket R
Intel® Server System R2312IP4LHPC End of Life 2U Rack Custom 14.2" x 15" Socket R

Ordering and Compliance

Ordering and spec information

  • Spare 750W Hot-Swap Power Supply FXX750GERPS (1U Form Factor, Gold-Efficiency), Single

  • Ordering Code FXX750GERPS

Trade compliance information

  • ECCNEAR99
  • CCATSNA
  • US HTS8504406018

PCN/MDDS Information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.

Refer to Datasheet for formal definitions of product properties and features.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

QR

Quality/Reliability Hold.

RS

Reschedule

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