Intel® Server Board S5520URT
|Status||End of Life|
|EOL Announce||Sunday, June 30, 2013|
|Last Order||Tuesday, December 31, 2013|
|Last Receipt Attributes||Wednesday, April 30, 2014|
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|# of QPI Links||3|
|Compatible Product Series||39565, 47915|
|Board Form Factor||SSI TEB-leveraged (12 x 13)|
|Chassis Form Factor||Rack|
|Integrated Systems Available||Yes|
|Integrated BMC with IPMI||IPMI 2.0|
|Embedded Options Available||Yes|
|Recommended Customer Price||N/A|
|Board Chipset||Intel® 5520 Chipset (Intel® 5520 I/O Hub)|
|Description||Highly Integrated, rack-optimized server board for enterprise data centers and high-performance computing|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||192 GB|
|Memory Types||DDR3 ECC UDIMM, RDIMM|
|Max # of Memory Channels||6|
|Max Memory Bandwidth||1333 GB/s|
|Max # of DIMMs||12|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||Yes|
|Max # of PCI Express Lanes||36|
|PCIe x8 Gen 2.x||3|
|PCIe x16 Gen 2.x||1|
|Connector for Intel® I/O Expansion Module x4 Gen 1||1|
|USB Revision||USB 2.0|
|# of USB Ports||5|
|Total # of SATA Ports||6|
|RAID Configuration||Intel Embedded RAID (0,1); upgradeable to RAID5|
|# of Serial Ports||2|
|# of LAN Ports||2|
|Integrated LAN||2x 1GbE|
|Max CPU Configuration||2|
|Low Halogen Options Available||See MDDS|
|Intel® Remote Management Module Support||AXXRMM3|
|Intel® Node Manager||Yes|
|Intel® Advanced Management Technology||No|
|Intel® Server Customization Technology||No|
|Intel® Build Assurance Technology||No|
|Intel® Efficient Power Technology||No|
|Intel® Quiet Thermal Technology||No|
-Network Interface Card
-Spares and Accessories
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.