Intel® Compute Module MFS5520VIR
|Status||End of Life|
|EOL Announce||Sunday, March 31, 2013|
|Last Order||Friday, November 01, 2013|
|Last Receipt Attributes||Sunday, March 30, 2014|
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|# of QPI Links||2|
|Compatible Product Series||39565, 47915|
|Board Form Factor||1U|
|Chassis Form Factor||Rack or Pedestal|
|Integrated BMC with IPMI||IPMI 2.0|
|Included Items||(1) Intel Compute Module based on the Intel® 5520 Chipset I/O Hub (IOH) and the Intel® 82801JR ICH10 RAID (Note: Requires installation in a system chassis at UFU V10.3 or V6.6 or higher to operate correctly)|
|Recommended Customer Price||N/A|
|Board Chipset||Intel® 5520 Chipset (Intel® 5520 I/O Hub)|
|Description||Intel Compute Module based on the Intel® 5520 Chipset I/O Hub (IOH) and the Intel® 82801JR ICH10 RAID (Note: Requires installation in a system chassis at UFU V10.3 or V6.6 or higher to operate correctly)|
|Target Market||Small and Medium Business|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||192 GB|
|Memory Types||DDR3 ECC UDIMM, RDIMM|
|Max # of Memory Channels||3|
|Max Memory Bandwidth||1066 GB/s|
|Max # of DIMMs||12|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||Yes|
|Graphics Output||Front Panel 15-Pin|
|USB Revision||USB 2.0|
|# of USB Ports||4|
|RAID Configuration||0,1, 1E, 5, 6, 10, 50, 60|
|# of LAN Ports||2|
|Integrated LAN||Intel® 82575EB Gigabit Ethernet Controller|
|Max CPU Configuration||2|
|Low Halogen Options Available||See MDDS|
|Intel® Virtualization Technology for Directed I/O (VT-d) ‡||Yes|
-Intel® Data Protection Technology
|AES New Instructions||Yes|
Ordering and Spec Information
Trade Compliance Information
Retired and Discontinued
|Spec Code||Ordering Code||Step||RCP|
|Intel® Compute MFS5520VI, Single|
|Intel® Compute MFS5520VIB, 3 Pack|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.