Intel® Workstation Board WX58BP
|Expected Discontinuance||April 30 2012|
|EOL Announce||Friday, September 30, 2011|
|Last Order||Monday, April 30, 2012|
|Last Receipt Attributes||Tuesday, January 31, 2012|
|Limited 3-year Warranty||Yes|
|Extended Warranty Available for Purchase (Select Countries)||Yes|
|Board Form Factor||Standard ATX|
|Chassis Form Factor||Rack and Pedestal|
|Integrated BMC with IPMI||No|
|Embedded Options Available||No|
|Recommended Customer Price||N/A|
|Board Chipset||Intel® X58 Express Chipset (Intel® X58 Express I/O Hub)|
|Description||Entry-level workstation board supports ECC memory|
|Target Market||Small Business/1st Server|
|Additional Information URL||Link|
|Max Memory Size (dependent on memory type)||16 GB|
|Memory Types||DDR3-UDIMM, ECCUDIMM|
|# of Memory Channels||3|
|Max Memory Bandwidth||1333 GB/s|
|# of DIMMs||4|
|ECC Memory Supported ‡||Yes|
|Integrated Graphics ‡||No|
|PCI Support||32 bit/33MHz|
|Max # of PCI Express Lanes||6|
|PCIe x1 Gen 2.x||0|
|PCIe x4 Gen 2.x||1|
|PCIe x8 Gen 2.x||0|
|PCIe x16 Gen 2.x||2|
|PCIe x1 Gen 1.x||2|
|PCIe x4 Gen 1.x||0|
|PCIe x8 Gen 1.x||0|
|PCIe x16 Gen 1.x||0|
|IO Expansion x4 Gen 1.x||0|
|IO Expansion x8 Gen 2.x||0|
|USB Revision||USB 2.0|
|# of USB Ports||12|
|USB 2.0 Configuration (Back + Internal)||12|
|Total # of SATA Ports||6|
|# of eSATA Ports||0|
|RAID Configuration||Intel Matrix RAID (0, 1, 5)|
|# of PATA Ports||0|
|# of Serial Ports||0|
|# of LAN Ports||1|
|Audio (back channel + front channel)||Dolby home theater with high definition audio|
|Integrated LAN||1x GbE|
|Integrated SAS Ports||0|
|Max CPU Configuration||1|
|Low Halogen Options Available||See MDDS|
|Intel® Remote Management Module Support||No|
|Intel® AC97 Technology||Yes|
|Intel® Matrix Storage Technology||Yes|
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.