Intel® G41 Express Chipset
(Intel® 82G41 Graphics and Memory Controller Hub)
Specifications
|
- Essentials |
||
| Status | Launched | |
| Launch Date | Q3'08 | |
| Supported FSBs | 1333MHz / 1066MHz / 800MHz | |
| FSB Parity | No | |
| Embedded Options Available | Yes | |
| TDP | 25 W | |
| Recommended Customer Price | T&R : $20.00 | |
| Datasheet | Link | |
|
- Memory Specifications |
||
| Memory Types | DDR3-1066 / DDR3-800 / DDR2-800 / DDR2-667 | |
| # of Memory Channels | 2 | |
| Physical Address Extensions | 36-bit | |
| ECC Memory Supported ‡ | No | |
|
- Graphics Specifications |
||
| Integrated Graphics ‡ | Yes | |
| Graphics Output | DisplayPort, DVI, sDVO, VGA | |
| Intel® Clear Video Technology | Yes | |
| # of Displays Supported ‡ | 2 | |
| Macrovision* License Required | No | |
|
- Expansion Options |
||
| PCI Express Revision | 1.1 | |
| PCI Express Configurations ‡ | 1x16 | |
| Max # of PCI Express Lanes | 16 | |
|
- Package Specifications |
||
| Max CPU Configuration | 1 | |
| TCASE | 102°C | |
| Package Size | 34mm x 34mm | |
| Low Halogen Options Available | See MDDS | |
|
- Advanced Technologies |
||
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No | |
| Intel® Fast Memory Access | No | |
| Intel® Flex Memory Access | Yes | |
|
- Intel® Platform Protection Technology |
||
| Trusted Execution Technology ‡ | No | |
Ordering and Spec Information
Trade Compliance Information
| ECCN | CCATS | US HTS |
|---|---|---|
| 5A992 | ME | 8542310000-CHPST |
Ordering and Spec Information
| Spec Code | Ordering Code | Step | RCP |
|---|---|---|---|
| 82G41 Graphics and Memory Controller Hub (GMCH) | |||
| SLGQ3 | AC82G41 | A3 | $20.00 |
Retired and Discontinued
| Spec Code | Ordering Code | Step | RCP |
|---|---|---|---|
| 82G41 Graphics and Memory Controller Hub (GMCH) | |||
| SLGPZ | AC82G41 | A3 | N/A |
| SLGRU | AC82G41 | A3 | N/A |
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
