Intel® Xeon® Processor 5000 Sequence

Intel® Xeon® Processor E5320

8M Cache, 1.86 GHz, 1066 MHz FSB

Specifications

Performance

Supplemental Information

Memory Specifications

Package Specifications

  • Sockets Supported LGA771, PLGA771
  • TCASE 66°C
  • Package Size 37.5mm x 37.5mm
  • Processing Die Size 286 mm2
  • # of Processing Die Transistors 582 million
  • Low Halogen Options Available See MDDS

Intel® Platform Protection Technology

Compatible Products

Server/Workstation Board

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available Compare
All | None
Intel® Server Board S5000PALR End of Life SSI TEB Rack LGA771 Yes
Intel® Server Board S5000XALR End of Life SSI-TEB Rack LGA771
Intel® Server Board S5000PSLROMBR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Server Board S5000PSLSASR End of Life SSI EEB (12" X 13") Pedestal LGA771 Yes
Intel® Server Board S5000PSLSATAR End of Life SSI EEB (12" X 13") Pedestal LGA771 Yes
Intel® Server Board S5000XSLSATAR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Server Board S5000VSA4DIMMR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Server Board S5000VSASASR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Server Board S5000VSASATAR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Server Board S5000VSASCSIR End of Life SSI EEB (12" X 13") Pedestal LGA771
Intel® Workstation Board S5000XVNSASR End of Life SSI EEB (12" x 13") Pedestal LGA771 No
Intel® Workstation Board S5000XVNSATAR End of Life SSI EEB (12" x 13") Pedestal LGA771 Yes

System

Product Name Status Chassis Form Factor Socket Compare
All | None
Intel® Server System SR1500ALR End of Life 1U Rack LGA771
Intel® Server System SR1500ALSASR End of Life 1U Rack LGA771
Intel® Server System SR1530CLR End of Life 1U Rack
Intel® Server System SR1550ALR End of Life 1U Rack LGA771
Intel® Server System SR1550ALSASR End of Life 1U Rack LGA771
Intel® Server System SR2500ALBRPR End of Life 2U Rack LGA771
Intel® Server System SR2500ALLXR End of Life 2U Rack LGA771
Intel® Server System SR1530HCLR End of Life 1U Rack

Product Images

Block Diagram

Ordering and Compliance

Retired and discontinued

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6

  • Spec Code SL9MV
  • Ordering Code BX80563E5320A
  • Step B3

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6

  • Spec Code SLAC8
  • Ordering Code BX80563E5320A
  • Step B3

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6

  • Spec Code SLAEL
  • Ordering Code BX80563E5320A
  • Step G0

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) Passive, FC-LGA6

  • Spec Code SL9MV
  • Ordering Code BX80563E5320P
  • Step B3

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) Passive, FC-LGA6

  • Spec Code SLAC8
  • Ordering Code BX80563E5320P
  • Step B3

Boxed Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) Passive, FC-LGA6

  • Spec Code SLAEL
  • Ordering Code BX80563E5320P
  • Step G0

Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6, Tray

  • Spec Code SL9MV
  • Ordering Code HH80563QH0368M
  • Step B2

Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6, Tray

  • Spec Code SLAC8
  • Ordering Code HH80563QH0368M
  • Step B3

Intel® Xeon® Processor E5320 (8M Cache, 1.86 GHz, 1066 MHz FSB) FC-LGA6, Tray

  • Spec Code SLAEL
  • Ordering Code HH80563QH0368M
  • Step G0

Trade compliance information

  • ECCN3A991.A.1
  • CCATSNA
  • US HTS8542310001

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

QR

Quality/Reliability Hold.

RS

Reschedule

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