Intel® 82910GL Graphics and Memory Controller

Specifications

Supplemental Information

Graphics Specifications

Expansion Options

Package Specifications

  • Max CPU Configuration 1
  • TCASE 99°C
  • Package Size 37.5mm x 37.5mm
  • Low Halogen Options Available See MDDS
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Ordering and Compliance

Trade compliance information

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export.

Refer to Datasheet for formal definitions of product properties and features.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.

The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Recommended Customer Price

Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s)

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

PA

Pre Active: Orders may be taken, but not scheduled, nor shipped.

AC

Active: This specific part is active.

EN

End of Life: Product End of Life notification has been published.

NO

No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.

OB

Obsolete: Inventory available. No future supplies will be available.

RP

Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.

RT

Retired: This specific part is no longer being manufactured or purchased and no inventory is available.

NI

Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.

QR

Quality/Reliability Hold.

RS

Reschedule

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