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Intel® Xeon® Processor 5070
(4M Cache, 3.46 GHz, 1066 MHz FSB)

SPECIFICATIONS

-
Essentials
Status End of Life
Processor Number 5070
# of Cores 2
Clock Speed 3.46 GHz
L2 Cache 4 MB
FSB Speed 1066 MHz
FSB Parity Yes
Instruction Set 64-bit
Embedded Options Available No
Lithography 65 nm
Max TDP 130 W
Scenario Design Power (SDP) 0 W
VID Voltage Range 1.075V-1.350V
Recommended Customer Price N/A
-
Package Specifications
TCASE 78°C
Package Size 37.5mm x 37.5mm
Processing Die Size 162 mm2
# of Processing Die Transistors 376 million
Sockets Supported PLGA771
Low Halogen Options Available See MDDS
-
Advanced Technologies
Intel® Turbo Boost Technology No
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® VT-x with Extended Page Tables (EPT) No
Intel® 64 Yes
Idle States No
Enhanced Intel SpeedStep® Technology Yes
Intel® Demand Based Switching No
-
Intel® Platform Protection Technology
Trusted Execution Technology No
Execute Disable Bit Yes

ORDERING AND SPEC INFORMATION

Retired and Discontinued

Spec Code Ordering Code Step ECCN CCATS US HTS RCP TDP
Boxed Intel® Xeon® Processor 5070 (4M Cache, 3.46 GHz, 1066 MHz FSB) FC-LGA6
SL969 BX805555070A C1 3A991.A.1 NA 8542310000-HYBRD N/A 100 W
Boxed Intel® Xeon® Processor 5070 (4M Cache, 3.46 GHz, 1066 MHz FSB) Passive, FC-LGA6
SL969 BX805555070P C1 3A991.A.1 NA 8542310000-HYBRD N/A 100 W
Intel® Xeon® Processor 5070 (4M Cache, 3.46 GHz, 1066 MHz FSB) FC-LGA6, Tray
SL969 HH80555KH0994M C1 N/A 130 W