ARK | Frequently Asked Questions (FAQ)

A: Much of the data is updated daily from Intel's Enterprise data stores.

A: For processors, the TDP will sometimes vary depending on the stepping of the processor. The Max TDP is the highest TDP value of all the steppings. Stepping TDP is the TDP for that particular stepping of the processor.

A: Embedded indicates that Intel anticipates shipping the product for an extended period of time. Embedded parts typically need to be procurable for 7+ years, whereas standard parts are typically procurable for 2+ years.

A: Low Halogen implies the following: Bromine and/or chlorine in materials that may be used during processing, but do not remain within the final product are not included in this definition. The halogens fluorine (F), iodine (I), and astatine (At) are not restricted by this standard. “BFR/CFR and PVC-Free” Definition: An article must meet all of the following requirements to be defined as “BFR/CFR and PVC-Free”: 1) All PCB laminates must meet Br and Cl requirements for low halogen as defined in IPC-4101B 2) For components other than PCB laminates, all homogeneous materials must contain < 900 ppm (0.09%) of Bromine [if the Bromine (Br) source is from BFRs] and < 900 ppm (0.09%) of Chlorine [if the Chlorine (Cl) source is from CFRs or PVC. Higher concentrations of Br and Cl are allowed in homogenous materials of components other than PCB laminates as long as their sources are not BFRs, CFRs, PVC. 3) Although the elemental analysis for Br and Cl in homogeneous materials can be performed by any analytical method with sufficient sensitivity and selectivity, the presence or absence of BFRs, CFRs or PVC must be verified by any acceptable analytical techniques that allow for the unequivocal identification of the specific Br or Cl compounds, or by appropriate material declarations agreed to between customer and supplier.

A: To provide feedback or request information: ARK_Support@intel.com . Optionally, use the "Send Feedback" link on the left hand side of each page.