Intel® Celeron® Processor 7305L

Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

For more details regarding the dynamic power and frequency operating range, refer to

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Processor Base Power

The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Launch Date

The date the product was first introduced.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Supported ^‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Name^‡

Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities.

Intel® Arc™ graphics only available on select V-Series Intel® Core™ Ultra processor-powered systems with qualifying system thermal design or H-series Intel® Core™ Ultra processor-powered systems with at least 16GB of system memory in a dual-channel configuration. OEM enablement required. Other Intel® Core™ Ultra processor-powered system configurations feature Intel® Graphics. Check with OEM or retailer for system configuration details.

Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.

Graphics Max Dynamic Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Max Resolution (HDMI)^‡

Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (DP)‡

Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (eDP - Integrated Flat Panel)‡

Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.

DirectX* Support

DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.

OpenGL* Support

OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.

OpenCL* Support

OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.

Multi-Format Codec Engines

Multi-Format Codec Engines provide hardware encoding and decoding for amazing video playback, content creation, and streaming usages.

Intel® Quick Sync Video

Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.

Intel® Thunderbolt™ 4

Universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.

Microprocessor PCIe Revision

Microprocessor PCIe Revision is the version supported by the processor for the PCIe lanes directly attached to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.

Chipset / PCH PCIe Revision

Chipset/PCH PCIe Revision is the version supported by the PCH for the PCIe lanes directly attached to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

T_JUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Max Operating Temperature

This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.

Intel® Volume Management Device (VMD)

Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

Intel® Gaussian & Neural Accelerator

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

Intel® Thread Director

Intel® Thread Director helps monitor and analyze performance data in real-time to seamlessly place the right application thread on the right core and optimize performance per watt.

Intel® Image Processing Unit

Intel® Image Processing Unit is an integrated image signal processor with advanced hardware implementation that improves image and video quality of cameras.

Intel® Smart Sound Technology

Intel® Smart Sound Technology is an integrated audio DSP (Digital Signal Processor) built to handle audio, voice, and speech interaction. It allows the latest Intel® Core™ processor-based PCs to respond to your voice command quickly and offer high fidelity audio without impact system performance and battery life.

Intel® Wake on Voice

Intel® Wake on Voice allows your device to wait and listen for your command without consuming excessive power and battery life, as well as wake from modern standby.

Intel® High Definition Audio

Audio interface for codecs to communicate with Intel SoCs and chipsets.

MIPI SoundWire*

SoundWire* interface is used by Audio Codecs to communicate with Intel SoCs and chipsets.

Intel® Deep Learning Boost (Intel® DL Boost) on CPU

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Intel® Adaptix™ Technology

Intel® Adaptix™ Technology is a collection of software tools used to tune the system for maximum performance and customize advanced system settings for such things as overclocking and graphics. These software tools help the system adapt these settings to its environment, utilizing machine learning algorithms and advanced power control settings.

Intel® Speed Shift Technology

Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Turbo Boost Technology ^‡

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology ^‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Control-Flow Enforcement Technology

CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Secure Key

Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

Execute Disable Bit ^‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Intel® Boot Guard

Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

Mode-based Execute Control (MBEC)

Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.

Intel® Virtualization Technology (VT-x) ^‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d) ^‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT) ^‡

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

What is the difference between Boxed and Tray Processors?