Intel® Server Board M50FCP2SBSTD

Specifications

Supplemental Information

  • Embedded Options Available No
  • Description Spreadcore form factor board supporting two Xeon® SP 350W TDP processors,
    16 DIMMs w/ 8x Intel® Optane™ PMM capable DIMMs per CPU.

Memory Specifications

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Security & Reliability

Ordering and Compliance

Ordering and spec information

Intel® Server Board M50FCP2SBSTD, 5 Pack

  • MM# 99AN21
  • Ordering Code M50FCP2SBSTD
  • MDDS Content IDs 774576

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473301180

PCN Information

Compatible Products

5th Gen Intel® Xeon® Scalable Processors

Product Name Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Compare
All | None
Intel® Xeon® Silver 4509Y Processor Q4'23 8 4.1 GHz 2.60 GHz 22.5 MB 125 W
Intel® Xeon® Silver 4510 Processor Q4'23 12 4.1 GHz 2.40 GHz 30 MB 150 W
Intel® Xeon® Silver 4510T Processor Q4'23 12 3.7 GHz 2.00 GHz 30 MB 115 W
Intel® Xeon® Bronze 3508U Processor Q4'23 8 2.2 GHz 2.10 GHz 22.5 MB 125 W
Intel® Xeon® Platinum 8571N Processor Q4'23 52 4 GHz 2.4 GHz 300 MB 300 W
Intel® Xeon® Platinum 8568Y+ Processor Q4'23 48 4 GHz 2.3 GHz 300 MB 350 W
Intel® Xeon® Gold 6530 Processor Q4'23 32 4 GHz 2.1 GHz 160 MB 270 W
Intel® Xeon® Platinum 8580 Processor Q4'23 60 4 GHz 2 GHz 300 MB 350 W
Intel® Xeon® Platinum 8558 Processor Q4'23 48 4 GHz 2.1 GHz 260 MB 330 W
Intel® Xeon® Platinum 8558P Processor Q4'23 48 4 GHz 2.7 GHz 260 MB 350 W
Intel® Xeon® Platinum 8592+ Processor Q4'23 64 3.9 GHz 1.9 GHz 320 MB 350 W
Intel® Xeon® Gold 6554S Processor Q4'23 36 4 GHz 2.2 GHz 180 MB 270 W
Intel® Xeon® Platinum 8570 Processor Q4'23 56 4 GHz 2.1 GHz 300 MB 350 W
Intel® Xeon® Platinum 8558U Processor Q4'23 48 4 GHz 2 GHz 260 MB 300 W
Intel® Xeon® Platinum 8581V Processor Q4'23 60 3.9 GHz 2 GHz 300 MB 270 W
Intel® Xeon® Platinum 8592V Processor Q4'23 64 3.9 GHz 2 GHz 320 MB 330 W
Intel® Xeon® Gold 6534 Processor Q4'23 8 4.2 GHz 3.9 GHz 22.5 MB 195 W
Intel® Xeon® Silver 4516Y+ Processor Q4'23 24 3.7 GHz 2.2 GHz 45 MB 185 W
Intel® Xeon® Silver 4514Y Processor Q4'23 16 3.4 GHz 2 GHz 30 MB 150 W
Intel® Xeon® Gold 6542Y Processor Q4'23 24 4.1 GHz 2.9 GHz 60 MB 250 W
Intel® Xeon® Gold 6526Y Processor Q4'23 16 3.9 GHz 2.8 GHz 37.5 MB 195 W
Intel® Xeon® Gold 5520+ Processor Q4'23 28 4 GHz 2.2 GHz 52.5 MB 205 W
Intel® Xeon® Gold 5515+ Processor Q4'23 8 4.1 GHz 3.2 GHz 22.5 MB 165 W
Intel® Xeon® Gold 6538Y+ Processor Q4'23 32 4 GHz 2.2 GHz 60 MB 225 W
Intel® Xeon® Gold 6548Y+ Processor Q4'23 32 4.1 GHz 2.5 GHz 60 MB 250 W
Intel® Xeon® Gold 6548N Processor Q4'23 32 4.1 GHz 2.8 GHz 60 MB 250 W
Intel® Xeon® Gold 6538N Processor Q4'23 32 4.1 GHz 2.1 GHz 60 MB 205 W
Intel® Xeon® Gold 6544Y Processor Q4'23 16 4.1 GHz 3.6 GHz 45 MB 270 W

4th Gen Intel® Xeon® Scalable Processors

Compare
All | None

Intel® Server M50FCP Family

Product Name Launch Date Marketing Status Board Form Factor Chassis Form Factor Socket Sort Order Compare
All | None
Intel® Server System M50FCP2UR312 Q1'23 Discontinued 18.79” x 16.84” 2U Rack Socket-E LGA4677 61862
Intel® Server System M50FCP2UR208 Q1'23 Discontinued 18.79” x 16.84” 2U Rack Socket-E LGA4677 61863
Intel® Server System M50FCP1UR212 Q1'23 Discontinued 18.79” x 16.84” 1U Rack Socket-E LGA4677 61864
Intel® Server System M50FCP1UR204 Q1'23 Discontinued 18.79” x 16.84” 1U Rack Socket-E LGA4677 61865

Intel® RAID Backup (Batteries/Flash)

Product Name Marketing Status Sort Order Compare
All | None
Intel® RAID Maintenance Free Backup AXXRMFBU7 Discontinued 63004

Intel® RAID Controllers

Compare
All | None

Heat-Sink Options

Compare
All | None

Spare Fan Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
1U Spare Fan Kit CYPFAN1UKIT Q2'21 Launched 65150
2U Spare Fan Kit CYPFAN2UKIT Q2'21 Launched 65159

Spare Heat-Sink Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
CPU Carrier Clip (4th Gen Intel® Xeon® Scalable Processors) AXXSPRXCCCC Q1'23 Launched 65256
CPU Carrier Clip (4th Gen Intel® Xeon® Scalable Processors) AXXSPRMCCCC Q1'23 Launched 65258

Spare Power Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
North America Power cable FPWRCABLENA Q2'06 Launched 65354

100GbE Intel® Ethernet Network Adapter E810

Compare
All | None

25GbE Intel® Ethernet Network Adapter E810

Compare
All | None

Intel® Ethernet Network Adapter X710

Compare
All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

BIOS and Firmware Update Package for UEFI for Intel® Server M50FCP Family

BIOS and System Firmware Update Package (SFUP) for Windows* and Linux* for Intel® Server M50FCP Family

Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 741 Chipset

Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 741 Chipset

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

Server Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems

Server Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems

Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.