Q: When is this website updated?
A: Much of the data is updated daily from Intel's Enterprise data stores.
Q: What does “Maximum System TDP” mean?
A: Maximum System TDP is the aggregate of the maximum TDP values for the Processor(s), MCH, and ICH of the grouping you have chosen or the search feature has found. Note that MCHs & ICHs may have varying TDP values depending on the number of active memory channels, the front-side bus speed, and other such factors. Please consult the respective Thermal Design Guides for the parts in question. For the sake of safe estimates, we have always chosen the highest possible TDP values.
Q: What's the difference between Max TDP and Stepping TDP?
A: For processors, the TDP will sometimes vary depending on the stepping of the processor. The Max TDP is the highest TDP value of all the steppings. Stepping TDP is the TDP for that particular stepping of the processor.
Q: What does “Embedded” mean?
A: Embedded indicates that Intel anticipates shipping the product for an extended period of time. Embedded parts typically need to be procurable for 7+ years, whereas standard parts are typically procurable for 2+ years.
Q: What does “Intel® SIPP” mean?
A: Intel® Stable Image Platform Program, established in 2003. Delivers standardized HW platform and image stability for 1 year after product launch.
Q: What do the prices listed represent for “system price” estimates?
A: For the sake of conservatism, the more expensive prices for the respective components are added up to provide a safe budgetary estimate assuming 1,000 piece pricing. Actual prices may vary. Also, some minor price savings may be possible by choosing specific offerings, such as products in trays over boxed products. Prices are listed in US Dollars and do not reflect the impact of shipping, taxes, and or tariffs – especially to other countries outside the United States. Prices are subject to change without notice. Special promotional arrangements may apply.
Q: What does Halogen Free Mean?
A: Halogen Free implies the following:
Bromine and/or chlorine in materials that may be used during processing, but do not remain within the final product are not included in this definition. The halogens fluorine (F), iodine (I), and astatine (At) are not restricted by this standard.
“BFR/CFR and PVC-Free” Definition:
An article must meet all of the following requirements to be defined as “BFR/CFR and PVC-Free”:
1) All PCB laminates must meet Br and Cl requirements for low halogen as defined in IPC-4101B
2) For components other than PCB laminates, all homogeneous materials must contain < 900 ppm (0.09%) of Bromine [if the Bromine (Br) source is from BFRs] and < 900 ppm (0.09%) of Chlorine [if the Chlorine (Cl) source is from CFRs or PVC. Higher concentrations of Br and Cl are allowed in homogenous materials of components other than PCB laminates as long as their sources are not BFRs, CFRs, PVC.
3) Although the elemental analysis for Br and Cl in homogeneous materials can be performed by any analytical method with sufficient sensitivity and selectivity, the presence or absence of BFRs, CFRs or PVC must be verified by any acceptable analytical techniques that allow for the unequivocal identification of the specific Br or Cl compounds, or by appropriate material declarations agreed to between customer and supplier.
Q: Who should I contact if I find an error or want more information?
A: To provide feedback or request information:
ARK_Support@intel.com. Optionally, use the "Send Feedback" link on the left hand side of each page.
