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| Name | Intel® Core™ i7-860 Processor (8M Cache, 2.80 GHz) | Intel® Core™ i5-750 Processor (8M Cache, 2.66 GHz) | Intel® Core™2 Duo Processor E8400 (6M Cache, 3.00 GHz, 1333 MHz FSB) | Intel® Core™2 Duo Processor E6600 (4M Cache, 2.40 GHz, 1066 MHz FSB) |
| Status | Launched | Launched | Launched | Launched |
| Launch Date | Q3'09 | Q3'09 | Q1'08 | Q3'06 |
| Processor Number | i7-860 | i5-750 | E8400 | E6600 |
| # of Cores | 4 | 4 | 2 | 2 |
| # of Threads | 8 | 4 | 2 | 2 |
| Processor Base Frequency | 2.8 GHz | 2.66 GHz | 3 GHz | 2.4 GHz |
| Max Turbo Frequency | 3.46 GHz | 3.2 GHz | | |
| Cache | 8 MB Intel® Smart Cache | 8 MB Intel® Smart Cache | 6 MB L2 Cache | 4 MB L2 Cache |
| Bus/Core Ratio | 21 | 20 | 9 | 9 |
| Bus Type | DMI | DMI | FSB | FSB |
| System Bus | 2.5 GT/s | 2.5 GT/s | 1333 MHz | 1066 MHz |
| FSB Parity | | | No | No |
| Instruction Set | 64-bit | 64-bit | 64-bit | 64-bit |
| Instruction Set Extensions | SSE4.2 | SSE4.2 | | |
| Embedded | Yes | Yes | Yes | No |
| Supplemental SKU | No | No | No | No |
| Processing Die Lithography | 45 nm | 45 nm | 45 nm | 65 nm |
| Max TDP | 95 W | 95 W | 65 W | 65 W |
| VID Voltage Range | | | 0.850v - 1.3625v | 0.850V - 1.500V |
| 1ku Bulk Budgetary Price | $284.00 | $196.00 | $163.00 | $224.00 |
| Memory Specifications |
Max Memory Size
(dependent on memory type) | 16 GB | 16 GB | | |
| Memory Types | DDR3-1066/1333 | DDR3-1066/1333 | | |
| # of Memory Channels | 2 | 2 | | |
| Max Memory Bandwidth | 21 GB/s | 21 GB/s | | |
| Physical Address Extensions | 36-bit | 36-bit | | |
| ECC Memory Supported | No | No | | |
| Graphics Specifications |
| Integrated Graphics | No | No | | |
| Expansion Options |
| PCI Express Revision | 2.0 | 2.0 | | |
| PCI Express Configurations | 1x16, 2x8 | 1x16, 2x8 | | |
| # of PCI Express Ports | 1 | 1 | | |
| I/O Specifications |
| Networking Specifications |
| Package Specifications |
| Max CPU Configuration | 1 | 1 | | |
| TCASE | | | 72.4°C | 60.1°C |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Processing Die Lithography | 45 nm | 45 nm | 45 nm | 65 nm |
| Processing Die Size | 296 mm2 | 296 mm2 | 107 mm2 | 143 mm2 |
| # of Processing Die Transistors | 774 million | 774 million | 410 million | 291 million |
| Sockets Supported | LGA1156 | LGA1156 | LGA775 | PLGA775 |
| Halogen Free Options Available | Yes | Yes | Yes | No |
| Advanced Technologies |
| Intel® Turbo Boost Technology | Yes | Yes | No | No |
| Intel® Hyper-Threading Technology | Yes | No | No | No |
| Intel® Virtualization Technology (VT-x) | Yes | Yes | Yes | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) | Yes | No | | |
| Intel® Trusted Execution Technology | Yes | No | Yes | No |
| AES New Instructions | No | No | | |
| Intel® 64 | Yes | Yes | Yes | Yes |
| Idle States | Yes | Yes | Yes | Yes |
| Enhanced Intel® Speedstep Technology | Yes | Yes | Yes | Yes |
| Intel® Demand Based Switching | No | No | No | No |
| Thermal Monitoring Technologies | No | No | Yes | Yes |
| Execute Disable Bit | Yes | Yes | Yes | Yes |
