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| Name | Intel® Core™ i7-870 Processor (8M Cache, 2.93 GHz) | Intel® Core™ i7-860 Processor (8M Cache, 2.80 GHz) |
| Status | Launched | Launched |
| Launch Date | Q3'09 | Q3'09 |
| Processor Number | i7-870 | i7-860 |
| # of Cores | 4 | 4 |
| Processor Base Frequency | 2.93 GHz | 2.8 GHz |
| Max Turbo Frequency | 3.6 GHz | 3.46 GHz |
| Cache | 8 MB Intel® Smart Cache | 8 MB Intel® Smart Cache |
| Bus/Core Ratio | 22 | 21 |
| Bus Type | DMI | DMI |
| System Bus | 2.5 GT/s | 2.5 GT/s |
| Instruction Set | 64-bit | 64-bit |
| Instruction Set Extensions | SSE4.2 | SSE4.2 |
| Embedded | No | No |
| Supplemental SKU | No | No |
| Lithography | 45 nm | 45 nm |
| Max TDP | 95 W | 95 W |
| 1ku Bulk Budgetary Price | $562.00 | $284.00 |
| Memory Specifications |
Max Memory Size
(dependent on memory type) | 16 GB | 16 GB |
| Memory Types | DDR3-1066/1333 | DDR3-1066/1333 |
| # of Memory Channels | 2 | 2 |
| Max Memory Bandwidth | 21 GB/s | 21 GB/s |
| Physical Address Extensions | 36-bit | 36-bit |
| ECC Memory Supported | No | No |
| Graphics Specifications |
| Expansion Slots |
| I/O Specifications |
| Networking Specifications |
| Package Specifications |
| Max CPU Configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Die Size | 296 mm2 | 296 mm2 |
| # of Transistors | 774 million | 774 million |
| Sockets Supported | LGA1156 | LGA1156 |
| Halogen Free Options Available | Yes | Yes |
| Advanced Technologies |
| Intel® Virtualization Technology | Yes | Yes |
| Execute Disable Bit | Yes | Yes |
| Enhanced Intel® Speedstep Technology | Yes | Yes |
| Enhanced Halt State (C1E) | Yes | Yes |
| Intel® 64 | Yes | Yes |
| AES New Instructions | No | No |
| Intel® Demand Based Switching | Yes | Yes |
| Intel® Turbo Boost Technology | Yes | Yes |
| Intel® Hyper-Threading Technology | Yes | Yes |
| Intel® Thermal Monitor 2 | No | No |
| Intel® Trusted Execution Technology | Yes | Yes |
| Intel® Virtualization Technology for Directed I/O | Yes | Yes |
